Reducing Selective and Iron Soldering Solder Balls

摘要

Solder balls due to spitting are a by-product of both laser and robotic iron soldering and are caused by excessive speed in the soldering process. FIGURE 1 illustrates the solder balls induced by spitting. A side-by-side evaluation needs to be conducted to compare materials to ensure the wire size and flux core are of the same volume. By testing different wires with the same feed rate and temperatures, wetting performance and degree of spitting can be compared on specifically designed test boards. After initial testing, the best wires can be tested with wire scoring or indentation to increase the speed of operation widiout solder balling. Reducing spitting by creating exhaust paths for the volatile material in the cored wire as the solder moves from a solid to a liquid can be very beneficial.