Characteristics of composite solder balls produced by an in-situ processing Part II: Reflow solderability of the Sn-Ag in-situ composite solder ball

摘要

In this study, the solderability of the in-situcomposite solders was investigated by reflow soldering the solderballs on a BT substrate. The reaction characteristics of thecomposite solders were evaluated by observing the microstructureof the solder/BLM interface. Also the effects of the number ofreflow soldering on the microstructure and the distribution of thereinforcement were investigated. These results indicated that thecomposite solder has a lower reactivity with the BLM and Cu, butits thermal stability must be improved significantly for actualapplications of the material.