Soldering tip with a non-wetting solder contact layer ; Soldering iron comprising such soldering tip ; Soldering system comprising such soldering iron

摘要

A soldering system for melting a solder (18) to form a joint (19) between a first workpiece (14) and a second workpiece (16) is described. The system may comprise an energy generating system (20), a soldering tip (22), and a dispenser adapted to dispense controlled amounts of the solder (18). The soldering tip (22) includes a non-wetting solder contact layer (32) in operative communication with the energy generating system (20). The energy generating system (20) may include induction, electrical, or heat generating systems in communication with the soldering tip (22). The non-wetting solder contact layer (32) comprises a material that is not wettable by the molten solder (18). The system permits control of an amount of the solder (18) in the joint (19).