Flow-over-wire Materials Enable Die Stacking

摘要

Recent advances in flow-over-wire (FOW) technologies, including FOW pastes and films, are enabling packaging engineers to design thinner packages, reduce manufacturing process steps and drive down overall package costs. Traditional single die IC packaging designs are being replaced by more complex, multi-die packaging configurations for today's in-demand applications. With the trend toward products offering more functionality and higher performance at a lower cost, package designers are using stacked-die chip-scale packages (SCSPs) and the like to provide higher performance while consuming the same footprint as conventional single-die packages. SCSPs combine two or more ICs, such as an ASIC and memory (SRAM and DDR), into one package by stacking the die, interconnecting them with wire bonding and molding everything into one standard package (Fig. 1). These packages provide a smaller footprint and lower profile compared with nonstacked packages. They also have lower packaging costs vs. individually packaged die or other 3-D packages.