首页> 外国专利> SEMICONDUCTOR DEVICES INCLUDING STACK OXIDE MATERIALS HAVING DIFFERENT DENSITIES OR DIFFERENT OXIDE PORTIONS, AND SEMICONDUCTOR DEVICES INCLUDING STACK DIELECTRIC MATERIALS HAVING DIFFERENT PORTIONS

SEMICONDUCTOR DEVICES INCLUDING STACK OXIDE MATERIALS HAVING DIFFERENT DENSITIES OR DIFFERENT OXIDE PORTIONS, AND SEMICONDUCTOR DEVICES INCLUDING STACK DIELECTRIC MATERIALS HAVING DIFFERENT PORTIONS

机译:半导体器件包括具有不同密度或不同氧化物部分的堆叠材料,以及包括具有不同部分的堆介质材料的半导体器件

摘要

Semiconductor structures may include a stack of alternating dielectric materials and control gates, charge storage structures laterally adjacent to the control gates, a charge block material between each of the charge storage structures and the laterally adjacent control gates, and a pillar extending through the stack of alternating oxide materials and control gates. Each of the dielectric materials in the stack has at least two portions of different densities and/or different rates of removal. Also disclosed are methods of fabricating such semiconductor structures.
机译:半导体结构可以包括交替介电材料和控制栅极的堆叠,横向邻近控制栅极的电荷存储结构,每个电荷存储结构和横向相邻的控制栅极之间的电荷块材料,以及延伸穿过堆叠的柱 交替的氧化物材料和对照栅极。 堆叠中的每个介电材料具有至少两部分不同的密度和/或不同的去除率。 还公开了制造这种半导体结构的方法。

著录项

  • 公开/公告号US2021335815A1

    专利类型

  • 公开/公告日2021-10-28

    原文格式PDF

  • 申请/专利权人 MICRON TECHNOLOGY INC.;

    申请/专利号US202117366471

  • 申请日2021-07-02

  • 分类号H01L27/11582;H01L29/16;H01L29/51;H01L21/311;H01L21/3213;H01L29/04;H01L29/66;H01L29/788;H01L21/02;H01L21/28;H01L21/8239;H01L27/11556;H01L29/792;H01L27/11551;

  • 国家 US

  • 入库时间 2022-08-24 21:57:06

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