Reliability Prediction of Thick Film Hybrid Integrated Circuits

摘要

When using the well known handbooks for reliability predicting (MIL, CNET) some problems occurin quality assessment of components which are not produced according to the requirements of the USmilitary or the French standards. The results obtained from tests of Test Pattern Circuits may be usedsuccessfully for reliability estimating during the design period of new thick film Hybrid IntegratedCircuits. Six types of Test Pattern Circuits were designed and tested and a model for estimating thickfilm Hybrid Integrated Circuits failure rate is proposed. Failure rate values predicted by using themethod with Test Pattern Circuits, and the results, obtained from the tests of two kinds of HybridIntegrated Circuits concerned for a 90% confidence level were compared.