Thick film resistive element, thick film printed circuit board and thick film hybrid integrated circuit device and their production methods

摘要

A thick film resistive element superior in moisture resistance characteristic is provided, which includes a pair of film-like conductors formed on an insulating substrate, a film-like resistor formed on the substrate so as to be partially laminated on the electrode portions of the pair of conductors thereby covering the surfaces of the electrode portions, and a first covering member formed of a material containing a crystal glass as a main ingredient thereof which covers the other portions of the pair of conductors than said electrode portions. As a result, there does not exist such an area that is covered with a porous amorphous glass film only, so that even if a protection film of an organic resin is not provided, there is no possibility that the moisture in the application environment affects on the conductors to degrade the insulation resistance therebetween. Thus, the use of this thick film resistive element makes it possible to realize a thick film printed circuit board and thick film hybrid integrated circuit device with no need to coat a protection film of an organic resin.