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Thick film resistor, thick film printer wiring substrate and its production manner and thick film hybrid integrated circuit
Thick film resistor, thick film printer wiring substrate and its production manner and thick film hybrid integrated circuit
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机译:厚膜电阻器,厚膜打印机布线基板及其制造方法和厚膜混合集成电路
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摘要
PURPOSE: To materialize a thick resistor excellent in moisture resistance by constituting it such that the exposed part of a conductor film has a crystalline glass film being made the electrode of a resistor, that a resistor film overlaps the crystalline glass film around the electrode partially and covers the section which includes the electrode so that it may not be exposed. ;CONSTITUTION: Conductor films 2a and 2b, which are made on an insulating board 1, are covered with crystalline glass boards 8a and 8b so that only the parts mounting pat part and the terminal connection may be exposed. A resistor film 3 is made on an electrode. The resistor film 3 are so made protruding out of the electrode both in length and in width, and cover the electrode completely Hereby, the insulation resistance between the conductor films can be prevented from deteriorating, and the moisture resistance can be improved. Accordingly, the manufacturing cost of a thick hybrid integrated circuit board can be cut down.;COPYRIGHT: (C)1993,JPO&Japio
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