BOARD OR ELECTRONIC COMPONENT WARP ANALYZING METHOD, BOARD OR ELECTRONIC COMPONENT WARP ANALYZING SYSTEM AND BOARD OR ELECTRONIC COMPONENT WARP ANALYZING PROGRAM

摘要

The board warp analysis method includes, in board warp calculation based on model data including at least a configuration and an elastic constant of a board and an electronic component including various kinds of parts which is mounted on the board, the processing of dividing a temperature profile indicative of a relationship between a temperature and a time with respect to the electronic component by a predetermined time, obtaining a relaxation elastic modulus of the electronic component corresponding to the divisional time by shifting on a time base of a master curve related to the electronic component which is composed with respect to a reference temperature based on a temperature-time conversion rule, calculating a curing degree of the electronic component based on a relationship between a time after shift and an actually applied temperature, and analyzing a warp of the electronic component based on a relaxation elastic modulus on the master curve corresponding to the curing degree or a relaxation elastic modulus calculated based on a relationship between the curing degree and the elastic constant according to a value of the curing degree calculated.