METHOD FOR ANALYZING WARP OF BOARD OR ELECTRONIC COMPONENT, SYSTEM FOR ANALYZING WARP OF BOARD OR ELECTRONIC COMPONENT AND PROGRAM FOR ANALYZING WARP OF BOARD OR ELECTRONIC COMPONENT

摘要

This board warp analyzing method includes the processing steps of dividing a temperature profile indicative of relation between a temperature and time for an electronic component by a prescribed period of time in calculation of a warp of a board based on model data including at least shapes and elastic constants of boards or electronic components including various components assembled on boards, acquiring a relaxation modulus corresponding to the divided period of time by shifting the same on a time axis of a master curve with respect to an electronic component that is synthesized with a standard temperature based on a conversion rule between a temperature and time, calculating the degree of hardening with respect to the electronic component based on relation between time after shifting and applied temperature, and analyzing a warp of the electronic component based on a relaxation modulus on the master curve corresponding to the degree of hardening or relation between the degree of hardening and an elastic constant in accordance with the degree of the calculated hardening.