Board or electronic component warp analyzing method, board or electronic component warp analyzing system and board or electronic component warp analyzing program

摘要

Board warp analysis includes dividing a temperature profile with respect to an electronic component by a predetermined time. A relaxation elastic modulus of the electronic component corresponding to the divisional time is obtained by shifting on a time base of a master curve related to the electronic component A curing degree of the electronic component is calculated based on a relationship between a time after shift and an actually applied temperature. A warp of the electronic component is analyzed based on a relaxation elastic modulus on the master curve or a relaxation elastic modulus calculated based on a relationship between the curing degree and the elastic constant according to a value of the curing degree calculated.