Moire fringe method of using warping deformation measurement of electronic components

摘要

Computers, mobile phones, cameras and video equipment and other electronic products , Moving in the light, thin, small, high speed, high reliability, multi-functional aspects of development , Namely, 3G technology and the SOCofo Therefore, the various components of the packaging technology have become increasingly demanding , Electronic components of residual stress after encapsulation and the use of temperature changes during, Body will be made electronic packaging warpage , Seriously affect the quality of the producto Therefore, to establish a set of micron, sub-micron-level detection method for testing.In this paper, Moire fringe method to measure warpage of electronic packages body volume,Was first proposedapplication of Rayleigh - Sommerfeld diffraction theory, Proof presented in this paper with a small spacing diffraction grating problems arising from the assumption can beovercome, Greatly improved the precision deformation measurement of electronic components,,