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METHOD FOR PRODUCING SEMICONDUCTOR CHIPS USING THIN-FILM TECHNOLOGY AND A SEMICONDUCTOR CHIP PRODUCED USING THIN-FILM TECHNOLOGY
METHOD FOR PRODUCING SEMICONDUCTOR CHIPS USING THIN-FILM TECHNOLOGY AND A SEMICONDUCTOR CHIP PRODUCED USING THIN-FILM TECHNOLOGY
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机译:用薄膜技术生产半导体芯片的方法和用薄膜技术生产半导体芯片
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摘要
For semiconductor chips (1) using thin film technology, an active layer sequence (20) is applied to a growth substrate (3), on which a reflective electrically conductive contact material layer (40) is then formed. The active layer sequence is patterned to form active layer stacks (2), and reflective electrically conductive contact material layer (40) is patterned to be located on each active layer stack (2). Then, a flexible, electrically conductive foil (6) is applied to the contact material layers as an auxiliary carrier layer, and the growth substrate is removed.
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