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Optical Properties of Silicon Oxide (SiO_x, x<2) Thin Films Deposited by PECVD Technique

机译:PECVD技术沉积氧化硅(SiO_x,x <2)薄膜的光学性质

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Silicon oxide thin films were deposited by using a plasma-enhanced chemical-vapor deposition technique to investigate the light emission properties. The photoluminescence characteristics were divided into two categories along the relative ratio of the flow rates of SiH_4 and N_2O source gases, which show light emission in the broad/visible range and a light emission peak at 380 nm. We attribute the broad/visible light emission and the light emission peak to the quantum confinement effect of nanocrystalline silicon and the Si=O defects, respectively. Changes in the photoluminescence spectra were observed after the post-annealing processes. The photoluminescence spectra of the broad light emission in the visible range shifted to the long Silicon oxide thin films were deposited by using a plasma-enhanced chemical-vapor deposition technique to investigate the light emission properties. The photoluminescence characteristics were divided into two categories along the relative ratio of the flow rates of SiH_4 and N_2O source gases, which show light emission in the broad/visible range and a light emission peak at 380 nm. We attribute the broad/visible light emission and the light emission peak to the quantum confinement effect of nanocrystalline silicon and the Si=O defects, respectively. Changes in the photoluminescence spectra were observed after the post-annealing processes. The photoluminescence spectra of the broad light emission in the visible range shifted to the long wavelength and were saturated above an annealing temperature of 900℃ or after 1 hour annealing at 970℃. However, the position of the light emission peak at 380 nm did not change at all after the post-annealing processes. The light emission intensities at 380 nm initially increased, and decreased at annealing temperatures above 700℃ or after 1 hour annealing at 700℃ . The photoluminescence behaviors after the annealing processes can be explained bythe size change of the nanocrystalline silicon and the density change of Si=O defect in the films, respectively. These results support the possibility of using a silicon-based light source for Si-optoelectronic integrated circuits and/or display devices.
机译:通过使用等离子体增强化学气相沉积技术沉积氧化硅薄膜,以研究其发光特性。沿着SiH_4和N_2O源气体的流量的相对比将光致发光特性分为两类,它们在宽/可见范围内显示发光,并且在380nm处显示发光峰。我们将宽/可见光发射和发光峰分别归因于纳米晶体硅和Si = O缺陷的量子约束效应。在后退火过程之后,观察到光致发光光谱的变化。采用等离子增强化学气相沉积技术沉积了可见光范围内的宽光谱光致发光光谱,并转移到长的氧化硅薄膜上。沿着SiH_4和N_2O源气体的流速的相对比将光致发光特性分为两类,它们在宽/可见范围内显示发光,并且在380nm处显示发光峰。我们将宽/可见光发射和发光峰分别归因于纳米晶体硅和Si = O缺陷的量子约束效应。在后退火过程之后,观察到光致发光光谱的变化。可见光范围内的宽光谱光致发光光谱向长波长偏移,在900℃以上的退火温度下或在970℃退火1小时后达到饱和。然而,在380nm后的发光峰的位置在退火后过程中完全没有改变。 380 nm处的发光强度最初增加,而在700℃以上的退火温度下或在700℃退火1小时后,发光强度降低。退火过程后的光致发光行为可以分别通过纳米晶硅的尺寸变化和薄膜中Si = O缺陷的密度变化来解释。这些结果支持了将硅基光源用于硅光电集成电路和/或显示设备的可能性。

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