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The effect of d.c. substrate bias on the properties of nitrogen-rich CNx films

机译:直流电的影响富氮CNx薄膜性能上的衬底偏压

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摘要

The influence of d.c. substrate bias on the properties of nitrogen-rich CNx films deposited by inductively coupled plasma chemical vapor deposition (ICP-CVD) utilizing transport reactions has been investigated. The film forming species are CN and/or (CN)(2) generated by the interaction of the atomic nitrogen from the ICP with a solid pure carbon mesh; they are deposited on the substrate in the presence of nitrogen species from the plasma. A study of the surface topography of the coatings by atomic force microscopy (AFM) shows that the average roughness slightly increases from below I nm without bias to 1.6 nm at -300 V. The deposition rate decreases by a factor of 1.3-1.5 (depending on the working pressure) with increasing the bias up to -300 V, mainly as a result of desorption of CN species from the substrate enhanced by the ion bombardment. The CNx films deposited with bias exhibit nitrogen atomic fraction N/(C + N) in the range of 50-60%, as revealed by surface and bulk techniques. The chemical bonding structure of the layers investigated by Fourier transform infrared (FTIR) spectroscopy showed only a marginal influence of the d.c. substrate bias. The increase of the refractive index n from 1.6 to 1.8 is probably due to slight densification of the films deposited with substrate biasing as a result of reduction of voids. (C) 2001 Elsevier Science B.V. All rights reserved. [References: 26]
机译:直流电的影响研究了利用传输反应通过电感耦合等离子体化学气相沉积(ICP-CVD)沉积的富氮CNx薄膜的特性对衬底偏压的影响。成膜物质是CN和/或(CN)(2),它是由ICP中的原子氮与固体纯碳网相互作用而生成的;它们在存在来自等离子体的氮物种的情况下沉积在基板上。通过原子力显微镜(AFM)对涂层表面形貌的研究表明,平均粗糙度从无偏置的1 nm以下逐渐增加至-300 V下的1.6 nm。沉积速率降低了1.3-1.5倍(取决于(最大工作压力)上的偏压增加到-300 V,这主要是由于离子轰击增强了CN物质从基材上的解吸所致。如表面和本体技术所揭示的那样,以偏置方式沉积的CNx膜的氮原子分数N /(C + N)在50-60%的范围内。用傅立叶变换红外(FTIR)光谱研究的层的化学键合结构仅显示了d.c的边际影响。底物偏差。折射率n从1.6到1.8的增加可能是由于减少了孔隙而导致在基材偏置的情况下沉积的薄膜的轻微致密化。 (C)2001 Elsevier Science B.V.保留所有权利。 [参考:26]

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