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Hybrid integrated circuit including thick film resistors and thin film conductors and technique for fabrication thereof
Hybrid integrated circuit including thick film resistors and thin film conductors and technique for fabrication thereof
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机译:包括厚膜电阻器和薄膜导体的混合集成电路及其制造技术
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摘要
A technique for the fabrication of hybrid integrated circuitry combining the expedients of thick and thin film technology is described. A novel processing sequence for attaining ohmic contact between thick film resistors and thin film conductive metallization involves the use of an interphase gold tab as a conductive link.
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