BONDING METHOD FOR ELECTRONIC COMPONENT WITH BUMP

摘要

PROBLEM TO BE SOLVED: To provide a bonding method for electronic component with bump capable of stably performing bonding improved in the strength of bonding. ;SOLUTION: Concerning the bonding method for pressing the bump of an electronic component with bump through a bonding tool to the electrode of a substrate and bonding the bump to the electrode of the substrate by applying vibrations, a first pressing load F1 capable of generating plastic deformation and a second pressing load F2 as a proper bonding load for bonding the bump are set to the bump. At the time of bonding operation, the electronic component is first pressed with the first pressing load F1 and next pressed with the second pressing load F2, and vibrations are applied to the electronic component with bump. Thus, even when there is a difference in the heights of substrates or dispersion in the heights of bumps, bonding improved in the strength of bonding can be performed while making uniform the state of abutting the bump and the electrode of the substrate.;COPYRIGHT: (C)1999,JPO