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Low-temperature fired ceramic circuit substrate with improved Ag- Au connection reliability
Low-temperature fired ceramic circuit substrate with improved Ag- Au connection reliability
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机译:具有改进的Ag-Au连接可靠性的低温烧制陶瓷电路基板
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摘要
A low-temperature fired ceramic circuit substrate includes a plurality of laminated insulating layers each formed of a low- temperature fired ceramic fired at a temperature ranging between 800 and 1,000 C., an inside layer wiring conductor formed of a conductive material of Ag system which is mainly composed of Ag, the inside layer wiring conductor being disposed in the inside insulating layer, a surface layer wiring conductor formed of a conductive material of Au system which is mainly composed of Au, the surface layer wiring conductor being disposed on the surface insulating layer, and an intermediate metal layer formed of a thick film paste of a conductive material of Au/Ag system which is mainly composed of Au/Ag, the intermediate metal layer being interposed between the inside layer wiring conductor and the surface layer wiring conductor.
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