Effect of thick film firing conditions on the solderability and structure of Au-Pt-Pd conductor for low-temperature, co-fired ceramic substrates

摘要

Low-temperature, co-fired ceramics (LTCC) are the substrate material-of-choice for a growing number of multi-chip module (MCM) applications. Unlike the longer-standing hybrid microcircuit technology based upon alumina substrates, the anufacturability and reliability of thick film soler joints on LTCC substrates have not been widely studied. An investigation was undertaken to fully characterize such solder joints. A surface mount test vehicle with Daisy chain electrical connections was designed and built with Dupont~(TM) 951 tape. The Dupont~(TM) 4569 thick film ink (Au76-Pt21-Pd3 wt.