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METHOD OF MANUFACTURING SINGLE-CRYSTAL GAN SUBSTRATE, AND SINGLE-CRYSTAL GAN SUBSTRATE

机译:制备单晶体gan基质的方法和单晶体gan基质

摘要

Manufacture at lower cost of off-axis GaN single-crystal freestanding substrates having a crystal orientation that is displaced from (0001) instead of (0001) exact. With an off-axis (111) GaAs wafer as a starting substrate, GaN is vapor-deposited onto the starting substrate, which grows GaN crystal that is inclined at the same off-axis angle and in the same direction as is the starting substrate. Misoriented freestanding GaN substrates may be manufactured, utilizing a misoriented (111) GaAs baseplate as a starting substrate, by forming onto the starting substrate a mask having a plurality of apertures, depositing through the mask a GaN single-crystal layer, and then removing the starting substrate. The manufacture of GaN crystal having a misorientation of 0.1° to 25° is made possible.
机译:以较低的成本制造具有偏离(0001)精确(0001)的晶体取向的偏轴GaN单晶独立式衬底。使用离轴(111)GaAs晶片作为起始衬底,将GaN气相沉积到起始衬底上,生长以与起始衬底相同的偏轴角和相同方向倾斜的GaN晶体。可以使用未定向的(111)GaAs基板作为起始基板,通过在起始基板上形成具有多个孔的掩模,并通过该掩模沉积GaN单晶层,然后去除GaN单晶层,来制造取向错误的独立式GaN基板。起始底物。可以制造取向度为0.1°至25°的GaN晶体。

著录项

  • 公开/公告号KR20060043770A

    专利类型

  • 公开/公告日2006-05-15

    原文格式PDF

  • 申请/专利权人 SUMITOMO ELECTRIC INDUSTRIES LTD.;

    申请/专利号KR20050022331

  • 发明设计人 KASAI HITOSHI;MOTOKI KENSAKU;

    申请日2005-03-17

  • 分类号H01L21/20;

  • 国家 KR

  • 入库时间 2022-08-21 21:25:50

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