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Apparatus and methods for packaging integrated circuit chips with antenna modules providing closed electromagnetic environment for integrated antennas
Apparatus and methods for packaging integrated circuit chips with antenna modules providing closed electromagnetic environment for integrated antennas
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机译:用天线模块封装集成电路芯片的设备和方法,为集成天线提供封闭的电磁环境
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摘要
Apparatus and methods are provided for packaging IC chips together with integrated antenna modules designed to provide a closed EM (electromagnetic) environment for antenna radiators, thereby allowing antennas to be designed independent from the packaging technology.
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