首页> 外国专利> Apparatus and methods for packaging integrated circuit chips with antenna modules providing closed electromagnetic environment for integrated antennas

Apparatus and methods for packaging integrated circuit chips with antenna modules providing closed electromagnetic environment for integrated antennas

机译:用天线模块封装集成电路芯片的设备和方法,为集成天线提供封闭的电磁环境

摘要

Apparatus and methods are provided for packaging IC chips together with integrated antenna modules designed to provide a closed EM (electromagnetic) environment for antenna radiators, thereby allowing antennas to be designed independent from the packaging technology.
机译:提供了用于将IC芯片与集成天线模块一起封装的设备和方法,所述集成天线模块被设计为天线辐射器提供封闭的EM(电磁)环境,从而允许天线的设计独立于封装技术。

著录项

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号