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Fast methods for full-wave electromagnetic simulations of integrated circuit package modules.

机译：集成电路封装模块全波电磁仿真的快速方法。

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Abstract not available.

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作者
T.V., Narayanan.;
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作者单位

Georgia Institute of Technology.;

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授予单位 Georgia Institute of Technology.;
学科 Engineering Electronics and Electrical.
学位 Ph.D.
年度 2011
页码 146 p.
总页数 146
原文格式 PDF
正文语种 eng
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3. Full-wave electromagnetic simulation of millimeter-wave active devices and circuits [J] . Samir Hammadi, Robert O. Grondin, Samir El-Ghazaly Annales des Telecommunications . 1999,第1a2期

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5. Full-wave surface integral equation method for electromagnetic-circuit simulation of three-dimensional interconnects in layered media. [D] . Karsilayan, Nur Kurt. 2010

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Fast methods for full-wave electromagnetic simulations of integrated circuit package modules.

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