首页> 外国专利> A METHOD FOR FORMING A RELAXED EPITAXIAL SI1-xGEx LAYER WITH A LOW-DENSITY OF THREADING DISLOCATIONS ON A SINGLE CRYSTALLINE SURFACE

A METHOD FOR FORMING A RELAXED EPITAXIAL SI1-xGEx LAYER WITH A LOW-DENSITY OF THREADING DISLOCATIONS ON A SINGLE CRYSTALLINE SURFACE

机译:一种在单晶表面上形成低密度螺旋位移的松弛表位SI1-xGEx层的方法

摘要

: A method to obtain thin (less than 300 nm) strain-relaxed Si1-xGex buffer layers on Si or silicon-on-insulator (SOI) substrates. These buffer layers have a homogeneous distribution of misfit dislocations that relieve the strain, remarkably smooth surfaces, and a low threading dislocation (TD) density, i.e. less than 106cm2. The approach begins with the growth of a pseudomorphic or nearlypseudomorphic Si1-xGex layer, i.e., a layer that is free of misfit dislocations, which is then implanted with He or other light elements and subsequently annealed to achieve the substantial strain relaxation. The very effective strain relaxation mechanism operatiing with this method is dislocation nucleation at He-inducedplatelets (not bubbles) that lie below the Si/Si1-xGex interface, parallel to the Si(001) surface
机译::一种在Si或绝缘体上硅(SOI)衬底上获得薄的(小于300 nm)应变松弛的Si1-xGex缓冲层的方法。这些缓冲层有一个错位错位的均匀分布可缓解应力,表面非常光滑且螺纹错位(TD)密度低,即小于106平方厘米该方法始于生长伪晶或近似伪晶的Si1-xGex层,即没有失配位错的层,然后将其植入He或其他轻元素,然后进行退火以实现充分的应变松弛。非常有效的应变使用此方法的松弛机制是位于Si / Si1-xGex界面下方的He诱导的血小板(不是气泡)处的位错形核,平行于Si(001)表面

著录项

  • 公开/公告号IN2005CN00935A

    专利类型

  • 公开/公告日2007-06-22

    原文格式PDF

  • 申请/专利权人

    申请/专利号IN935/CHENP/2005

  • 申请日2005-05-16

  • 分类号H01L21/302;

  • 国家 IN

  • 入库时间 2022-08-21 20:58:16

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