首页> 外国专利> EPITAXIAL GROWTH OF THIN SMOOTH GERMANIUM (Ge) ON SILICON (Si) UTILIZING AN INTERFACIAL SILICON GERMANIUM (SiGe) PULSE GROWTH METHOD

EPITAXIAL GROWTH OF THIN SMOOTH GERMANIUM (Ge) ON SILICON (Si) UTILIZING AN INTERFACIAL SILICON GERMANIUM (SiGe) PULSE GROWTH METHOD

机译:利用界面硅锗(SiGe)脉冲生长法在硅(Si)上生长稀薄锗(Ge)

摘要

Disclosed is a method of growing thin and smooth germanium (Ge) on a strained or relaxed silicon (Si) layer comprising the steps of: (a) treating surface of the strained or relaxed Si layer to gaseous precursors of both Si (e.g., silane) and Ge (e.g., germane) for a predetermined short time duration Δt, where 1≦Δt≦30 seconds; and (b) depositing a thin Ge film on top of said treated Si layer, wherein said treatment step of (a) reduces growth time and surface roughness of the thin Ge film (e.g., sub-5 nm or sub-20 nm thick) deposited on the Si layer. The treatment step (a) can be conducted at a steady predetermined temperature T, where 450≦T≦900° C. The predetermined short time duration Δt can be chosen such that less than 10 A of SiGe is deposited.
机译:公开了一种在应变或弛豫的硅(Si)层上生长薄且光滑的锗(Ge)的方法,该方法包括以下步骤:(a)将应变或弛豫的Si层的表面处理成两种Si(例如硅烷)的气态前体)和Ge(例如锗烷)持续预定的短持续时间Δt,其中1≤Δt≤30秒; (b)在所述处理的Si层的顶部上沉积Ge薄膜,其中,(a)的所述处理步骤减少了Ge薄膜的生长时间和表面粗糙度(例如,小于5nm或小于20nm的厚度)沉积在硅层上。处理步骤(a)可以在稳定的预定温度T下进行,其中450≤T≤900℃。可以选择预定的短持续时间Δt,使得沉积少于10 A的SiGe。

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