Substrate or electronic component warpage analysis method, substrate or electronic component warpage analysis system, and substrate or electronic component warpage analysis program

摘要

This warpage analysis method for a board expresses the relationship between temperature and time for an electronic component in calculating the warpage of the board based on model data including at least the shape and elastic constant of the electronic component including the board and various components mounted on the board Dividing the temperature profile by a predetermined time and shifting the relaxation modulus of the electronic component corresponding to the division time on the time axis of the master curve for the electronic component synthesized for the reference temperature based on the conversion rule of temperature and time The degree of curing of the electronic component is calculated based on the relationship between the time after the shift and the actually applied temperature, and the master curve corresponding to the degree of curing is calculated according to the calculated degree of curing. The processing includes analyzing the warp of the electronic component based on the relaxation elastic modulus or the relaxation elastic modulus calculated based on the relationship between the degree of cure and the elastic constant.