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Warpage analysis method for board or electronic component, warpage analysis system for board or electronic component, and warpage analysis program for board or electronic component
Warpage analysis method for board or electronic component, warpage analysis system for board or electronic component, and warpage analysis program for board or electronic component
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机译:板或电子部件的翘曲分析方法,板或电子部件的翘曲分析系统以及板或电子部件的翘曲分析程序
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摘要
Board warp analysis includes dividing a temperature profile with respect to an electronic component by a predetermined time. A relaxation elastic modulus of the electronic component corresponding to the divisional time is obtained by shifting on a time base of a master curve related to the electronic component A curing degree of the electronic component is calculated based on a relationship between a time after shift and an actually applied temperature. A warp of the electronic component is analyzed based on a relaxation elastic modulus on the master curve or a relaxation elastic modulus calculated based on a relationship between the curing degree and the elastic constant according to a value of the curing degree calculated.
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