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SOLVING METHOD OF A SUBSTRATE WARPAGE PROBLEM DUE TO HEAT EXPANSION CONTRACTION RATE DIFFERENCE CAPABLE OF PREVENTING THE DAMAGE OF THE SUBSTRATE AND AN ELECTRONIC COMPONENT BUILT-IN PRINTED CIRCUIT BOARD APPLYING THE METHOD
SOLVING METHOD OF A SUBSTRATE WARPAGE PROBLEM DUE TO HEAT EXPANSION CONTRACTION RATE DIFFERENCE CAPABLE OF PREVENTING THE DAMAGE OF THE SUBSTRATE AND AN ELECTRONIC COMPONENT BUILT-IN PRINTED CIRCUIT BOARD APPLYING THE METHOD
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机译:能够防止基体损伤的热膨胀收缩率差异的基体翘曲问题的解决方法和采用该方法的电子部件内置电路板
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摘要
PURPOSE: A solving method of a substrate warpage problem due to heat expansion contraction rate difference and an electronic component built-in printed circuit board applying the method are provided to prevent a warpage occurrence of the substrate by using a laminate-molded material in which maintaining more than 50% of the content of the ceramic filler.;CONSTITUTION: A cavity is manufactured in an internal layer insulating layer(180) of a hardened status. An electronic component(170) is built in the cavity. A first insulation layer and a copper foil(190) of a semi-hardened status are laminated on the electronic component. A via hole is formed after the first insulation layer is solidified. The via hole electronically connects the copper foil of the substrate outside layer and an input-output terminal bump of the electronic component.;COPYRIGHT KIPO 2013
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