首页> 外国专利> GROUP III/V NITRIDE SEMICONDUCTOR, PHOTOCATALYST SEMICONDUCTOR ELEMENT, PHOTOCATALYTIC REDOX REACTION APPARATUS, AND PHOTOELECTROCHEMICAL REACTION EXECUTION METHOD

GROUP III/V NITRIDE SEMICONDUCTOR, PHOTOCATALYST SEMICONDUCTOR ELEMENT, PHOTOCATALYTIC REDOX REACTION APPARATUS, AND PHOTOELECTROCHEMICAL REACTION EXECUTION METHOD

机译:III / V组氮化物半导体,光催化剂半导体元素,光催化氧化还原反应装置以及光电化学反应执行方法

摘要

Provided are a III/V group nitride semiconductor causing an oxidation-reduction reaction at a high photoconversion efficiency by irradiation of light, a photocatalytic semiconductor device, a photocatalytic oxidation-reduction reaction apparatus, and an execution process of a photoelectrochemical reaction.;In the III/V group nitride semiconductor, the full width at half maximum of an X-ray rocking curve on a catalytic reaction surface thereof is 400 arcsec or less, and a carrier density in a surface layer portion having the catalytic reaction surface is 1.5 x 1016 cm-3 or more, but 3.0 x 1018 cm-3 or less. The photocatalytic semiconductor device has the III/V group nitride semiconductor laminated on a substrate. In the photocatalytic oxidation-reduction reaction apparatus, one electrode of a pair of electrodes for electrolysis, which are electrically connected to each other in a state brought into contact with an electrolyte, is composed of the III/V group nitride semiconductor, and a catalytic reaction surface making up the III/V group nitride semiconductor is irradiated with light, thereby causing an oxidation reaction or reduction reaction on the catalytic reaction surface.
机译:本发明提供一种III / V族氮化物半导体,其通过光的照射以高的光转换效率进行氧化还原反应,光催化半导体装置,光催化氧化还原反应装置以及光电化学反应的执行工序。 III / V族氮化物半导体,其催化反应面上的X射线摇摆曲线的半峰全宽为400arcsec以下,具有催化反应面的表层部的载流子密度为1.5×1016。 cm-3或更大,但3.0 x 1018 cm-3或更小。光催化半导体器件具有层压在基板上的III / V族氮化物半导体。在光催化氧化还原反应装置中,一对电解电极中的一个电极以与电解质接触的状态彼此电连接,该电极由III / V族氮化物半导体和催化剂构成。用光照射构成III / V族氮化物半导体的反应表面,从而在催化反应表面上引起氧化反应或还原反应。

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