首页> 外国专利> GROUP III/V NITRIDE SEMICONDUCTOR, PHOTOCATALYST SEMICONDUCTOR ELEMENT, PHOTOCATALYTIC REDOX REACTION APPARATUS, AND PHOTOELECTROCHEMICAL REACTION EXECUTION METHOD

GROUP III/V NITRIDE SEMICONDUCTOR, PHOTOCATALYST SEMICONDUCTOR ELEMENT, PHOTOCATALYTIC REDOX REACTION APPARATUS, AND PHOTOELECTROCHEMICAL REACTION EXECUTION METHOD

机译:III / V族氮化物半导体,光催化剂半导体元素,光催化氧化还原反应装置以及光电化学反应执行方法

摘要

This invention provides a group III/V nitride semiconductor, which causes a redox reaction with high phototransformation efficiency upon light irradiation, a photocatalyst semiconductor element, a photocatalytic redox reaction apparatus, and a photoelectrochemical reaction execution method. The group III/V nitride semiconductor is characterized in that the full width at half maximum of an X-ray rocking curve for the catalytic reaction face is not more than 400 arcsec and the carrier concentration in a surface layer part having the catalytic reaction face is not less than 1.5 × 1016 cm-3 and not more than 3.0 × 1018 cm-3. The photocatalyst semiconductor element is characterized in that the above group III/V nitride semiconductor is stacked on a substrate. The photocatalytic redox reaction apparatus is characterized in that one of a pair of electrolysis electrodes which are in contact with an electrolysis solution for electrical connection to each other is formed of the above group III/V nitride semiconductor, and, upon exposure of light to the catalytic reaction face constituting the group III/V nitride semiconductor, an oxidation reaction or a reduction reaction takes place in the catalytic reaction face.
机译:本发明提供一种III / V族氮化物半导体,光催化剂半导体元件,光催化氧化还原反应装置以及光电化学反应执行方法,该III / V族氮化物半导体在光照射时引起具有高光转化效率的氧化还原反应。 III / V族氮化物半导体的特征在于,用于催化反应面的X射线摇摆曲线的半峰全宽不超过400弧秒,并且在具有催化反应面的表层部分中的载流子浓度为200。不小于1.5×1016 cm-3且不大于3.0×1018 cm-3。光催化剂半导体元件的特征在于,上述III / V族氮化物半导体层叠在基板上。该光催化氧化还原反应设备的特征在于,与上述电解溶液接触以彼此电连接的一对电解电极中的一个由上述III / V族氮化物半导体形成,并且在将光暴露于其中时形成。构成III / V族氮化物半导体的催化反应面,在该催化反应面上发生氧化反应或还原反应。

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