SUBSTRATE FOR A SEMICONDUCTOR PACKAGE AND THE SEMICONDUCTOR PACKAGE USING THE SUBSTRATE AND A METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE USING THE SAME, CAPABLE OF IMPROVING THE RELIABILITY OF BONDING

摘要

PURPOSE: A substrate for a semiconductor package and the semiconductor package using the substrate and a method of manufacturing the semiconductor package using the same are provided to improve the adhesive force and conductivity between a bump and a pad by correcting the mismatch of the pump and the pad.;CONSTITUTION: A substrate body(100) comprises one side and the other side which are faced to each other. A pad part(102) and a trace portion(102b) are formed by a conductive metal material. A stress adsorption part(103) is formed by a material including an elasticity and an electrical property. A piezoelectric element part(104) is formed in a part facing the stress adsorption part. A pad part, a stress adsorption part, an insulating pattern(SR1) exposing the piezoelectric element part are formed in one side of the substrate body.;COPYRIGHT KIPO 2012