首页>
外国专利>
Methods of forming high aspect ratio plated through holes and high precision stub removal in a printed circuit board
Methods of forming high aspect ratio plated through holes and high precision stub removal in a printed circuit board
展开▼
机译:在印刷电路板中形成高纵横比的镀通孔和高精度短线去除的方法
展开▼
页面导航
摘要
著录项
相似文献
摘要
The present invention relates to printed circuit boards (PCBs), and more particularly, to methods of forming high aspect ratio through holes and high precision stub removal in a printed circuit board (PCB). The high precision stub removal processes may be utilized in removing long stubs and short stubs. In the methods, multiple holes of varying diameter and depth are drilled from an upper and/or lower surface of the printed circuit board utilizing drills of different diameters.
展开▼