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Study of beryllium diffusion mechanisms in InGaAs epitaxial layers grown by CBE

机译:CBE生长InGaAs外延层中铍扩散机理的研究

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The aim of this work is to investigate beryllium diffusion during post-growth annealing in InGaAs epitaxial layers. Indeed, this undesirable diffusion may occur during thermal treatments of InGaAs/InP heterojunction bipolar transistors (HBTs), which can generate a limitation of frequency performances of these devices. Epitaxial structures have been grown by chemical beam epitaxy (CBE). After post-growth rapid thermal annealing (RTA) was performed, secondary ion mass spectrometry (SIMS) was used to characterize the Be depth profiles, in parallel with our experimental study, we consider two models of Be diffusion in InGaAs in the case of point defect nonequilibrium First, a kick-out diffusion model with neutral Be interstitial species and charged point defects was studied. Then, a combined substitutional-interstitial diffusion model based on simultaneous diffusion by dissociative and kick-out mechanisms is suggested. Good agreements between experimental depth profiles and simulated curves have been obtained. [References: 23]
机译:这项工作的目的是研究InGaAs外延层在生长后退火过程中铍的扩散。实际上,这种不希望有的扩散可能在InGaAs / InP异质结双极晶体管(HBT)的热处理过程中发生,这可能会限制这些器件的频率性能。外延结构已经通过化学束外延(CBE)生长。进行生长后快速热退火(RTA)后,使用二次离子质谱(SIMS)表征Be深度分布,与我们的实验研究并行,我们考虑了在InGaAs中Be扩散的两种模型缺陷非平衡首先,研究了具有中性Be间隙物种和带电点缺陷的踢出扩散模型。然后,提出了一种基于解离和踢出机制同时扩散的组合替代-填隙扩散模型。实验深度剖面和模拟曲线之间已取得良好的一致性。 [参考:23]

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