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首页> 外文期刊>Current applied physics: the official journal of the Korean Physical Society >New trench gate power MOSFET with high breakdown voltage and reduced on-resistance using a SiGe zone in drift region
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New trench gate power MOSFET with high breakdown voltage and reduced on-resistance using a SiGe zone in drift region

机译:新型沟槽栅极功率MOSFET具有高击穿电压并在漂移区中使用SiGe区域降低了导通电阻

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摘要

High breakdown voltage and reduced on-resistance are desired characteristics in power MOSFETs. In order to obtain an excellent performance of Trench Gate Power MOSFET, we have proposed a new structure in which a SiGe zone is incorporated in the drift region to reduce on-resistance. Also, the buried oxide is considered in the drift region that surrounds the SiGe zone to increase breakdown voltage. The proposed structure is called a SiGe Zone Trench Gate MOSFET (SZ-TG). Our simulation with two dimensional simulator shows that by reducing an electric field and controlling the effects of parasitic BJT transistor in the SZ-TG structure, we can expand power applications of trench gate power structures.
机译:高击穿电压和降低的导通电阻是功率MOSFET的理想特性。为了获得沟槽式栅极功率MOSFET的出色性能,我们提出了一种新结构,其中在漂移区中合并了SiGe区,以降低导通电阻。同样,埋入的氧化物被认为是在围绕SiGe区的漂移区中,以增加击穿电压。提出的结构称为SiGe区域沟槽栅MOSFET(SZ-TG)。我们用二维模拟器进行的仿真表明,通过减小电场并控制SZ-TG结构中的寄生BJT晶体管的影响,我们可以扩展沟槽栅极功率结构的功率应用。

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