X-ray Lithography: Back for Round 2

摘要

In a recent Editorial space, I said that X-ray lithography as a mainstream next-generation lithography (NGL) technique was dead (see Semiconductor International, June 2002, p. 15). A technique based in traditions of huge money- and space-eating synchrotrons, after all, really had no place in the future of commercial silicon processes, and anybody still dreaming that dream needed to, well, wake up. I'm still not sure that any X-ray lithography technique will ultimately be able to overcome the stigma that has come to dog that end of the spectrum, and win the hearts necessary to make it a marketable NGL success. But at least one company seems to have a shot at it. JMAR Technologies Inc. (San Diego) has already made great strides in the practical development of a unique and viable NGL technique that overcomes the problems associated with traditional XRL.