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首页> 外文期刊>Japanese journal of applied physics >Dry etching of deep air holes in GaAs/AIGaAs-based epi-wafer having InAs quantum dots for fabrication of photonic crystal laser
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Dry etching of deep air holes in GaAs/AIGaAs-based epi-wafer having InAs quantum dots for fabrication of photonic crystal laser

机译:干法刻蚀具有InAs量子点的GaAs / AIGaAs基外延晶片中的深孔,用于制造光子晶体激光器

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摘要

Photonic crystal (PhC) structures are often fabricated on epi-wafers with a heterostructure to realize various micro-or nanophotonic devices by dry etching processes. We discuss the dry etching process for a GaAs/AlGaAs-based epi-wafer using a resist mask to fabricate a proposed PhC laser. The epi-wafer has multiple stacked layers of InAs quantum dots (QDs) with a high density of 6 x 10(10)cm(-2) , which cause the reduction of the diameter of the etched air holes. A higher density and more stacked layers of QDs intensify the reduction effect. By enhancing the physical etching effect, the verticality of the profile of the air holes etched in the epi-wafer with a five stacked InAs QD layers is greatly improved. The results show that the improved etching conditions make it feasible to fabricate the proposed PhC laser structure. (C) 2017 The Japan Society of Applied Physics
机译:通常在具有异质结构的Epi晶片上制造光子晶体(PhC)结构,以通过干法蚀刻工艺实现各种微或纳米光子器件。我们讨论了使用抗蚀剂掩模对GaAs / AlGaAs基外延晶片进行干法刻蚀的过程,以制造建议的PhC激光器。外延晶片具有多层堆叠的InAs量子点(QD),具有6 x 10(10)cm(-2)的高密度,这会导致蚀刻气孔直径的减小。更高密度和更多堆叠的QD层会增强还原效果。通过增强物理蚀刻效果,大大提高了在具有五个堆叠的InAs QD层的Epi晶片中蚀刻的气孔轮廓的垂直度。结果表明,改进的刻蚀条件使得制造所提出的PhC激光器结构可行。 (C)2017日本应用物理学会

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