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首页> 外文期刊>Electron Device Letters, IEEE >Low-Leakage and Low-Trigger-Voltage SCR Device for ESD Protection in 28-nm High- k Metal Gate CMOS Process
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Low-Leakage and Low-Trigger-Voltage SCR Device for ESD Protection in 28-nm High- k Metal Gate CMOS Process

机译:用于28nm High-k金属栅极CMOS工艺中的ESD保护的低泄漏,低触发电压SCR器件

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摘要

To effectively protect integrated circuits from electrostatic discharge (ESD) damage, this letter proposes a silicon-controlled rectifier (SCR) device with low trigger voltage, low leakage current, low parasitic capacitance, and which requires no additional process step. The proposed device uses two metal gates to separate the anode and cathode of the SCR to reduce the leakage current. These two gates are well controlled to trigger the SCR device. The test devices have been implemented and verified in a 28-nm high-k metal gate CMOS process. Experimental results show that the proposed SCR exhibits a low trigger voltage ( 1 kV in human-body-model tests). Based on its good performances during ESD stress and normal circuit operating conditions, the proposed SCR device is very suitable for ESD protection in advanced CMOS processes.
机译:为了有效地保护集成电路免受静电放电(ESD)的损害,这封信提出了一种硅控制整流器(SCR)器件,该器件具有低触发电压,低泄漏电流,低寄生电容,并且不需要额外的处理步骤。拟议的设备使用两个金属栅将SCR的阳极和阴极分开,以减少泄漏电流。对这两个门进行良好的控制以触发SCR器件。测试设备已经在28nm高k金属栅极CMOS工艺中实现和验证。实验结果表明,所提出的可控硅具有较低的触发电压(人体模型测试为1 kV)。基于其在ESD应力和正常电路工作条件下的良好性能,所提出的SCR器件非常适合高级CMOS工艺中的ESD保护。

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