Flip Chip Attach Process and material options

摘要

Flip chip is a technology where semiconductor devices are mounted and electrically connected face-down directly onto substrates (Figure 1). Nearly 1.5 billion flip chips are produced annually, according to a report from Electronic Trend Publications. There are various applications from low-end customer products to high-end microprocessors with a very high number of I/Os (up to 2,000 pins). Flip chips can also be found in electronic watches, calculators, cellular phones, electronic organizers, cameras and many other products. The driving forces for flip chip include: 1. Superior electrical performance with reduced inductance and capacitance of the connections and shortened signal paths. Flip chip devices usually allow much higher speeds than wire bonded devices. 2. Lower electromagnetic emissions, with no wire bond loops. 3. Flexibility in layout and the potential for a high number of connections per chip area. This can also lead to smaller packages or more functionality in the same size. 4. Better heat transfer characteristics, with a heat sink directly attached to the die. 5. High potential for cost reduction.