Next-generation packaging for

摘要

Next-generation packaging for fiber optic and MEMS modules will require improved levels of mechanical, thermal and environmental stability combined with increased capability to integrate electrical and optical functions. Additionally, all of this must be delivered to the market faster and at system cost. Thick film and low temperature co-fired ceramic (LTCC) materials, effective in harsh-environment military and high-volume automotive and wireless applications, possess the required attributes. This article reviews the properties of thick film and LTCC packaging and interconnect materials compared to the needs for packaging fiber optic and MEMS modules.