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The GAAFETs with Five Stacked Ge Nano-sheets Made by 2D Ge/Si Multilayer Epitaxy, Excellent Selective Etching, and Conformal Monolayer Doping

机译:带有五个堆叠的GE纳米片的GAAFET由2D GE / SI多层外延,优异的选择性蚀刻和共形式单层掺杂制成

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Horizontally five stacked pure-Ge nanosheets (NSs) GAA FETs are demonstrated. In this device process, we intentionally grow large mismatch Ge/Si multilayers rather than Ge/GeSi multilayers as the starting material, because the large difference of material properties between Ge/Si is beneficial to the selective etching process. In order to avoid island growth, the flat Ge/Si multilayers are grown at a low temperature. Due to the excellent selective etching, the shape of Ge NSs almost keeps unchanged after etching. Additionally we found the dislocations in suspended Ge sheets are more easily to remove than the case that Ge layers are still tied with Si layers. Since the stacked NSs channels is tall and the pitch between channels is short, the conventional wrap-around contact (WAC) is not applicable. Here for the first time we propose the conformal monolayer doping (MLD) method for source/drain doping of tall NSs FETs.
机译:水平五个堆叠的纯-GENOSHENS(NSS)GAA FET被证明。在该设备过程中,我们故意将大型不匹配GE / Si多层而不是Ge / Gesi多层作为起始材料,因为Ge / Si之间的材料特性差异有利于选择性蚀刻工艺。为了避免岛的生长,扁平的GE / Si多层在低温下生长。由于选择性蚀刻优异,GE NSS的形状几乎保持蚀刻后保持不变。此外,我们发现悬浮的GE板中的脱位比GE层仍然与Si层绑定的情况更容易移除。由于堆叠的NSS通道高,并且通道之间的间距短,因此传统的环绕环绕(WAC)不适用。在这里首次提出了高NSS FET的源/排水掺杂的共形单层掺杂(MLD)方法。

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