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Analysis of Radiation-induced Cross Domain Errors in TMR Architectures on SRAM-based FPGAs

机译:基于SRAM基FPGA的TMR架构中辐射造成的横域误差分析

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SRAM-Based FPGAs represent a low-cost alternative to ASIC device thanks to their high performance and design flexibility. In particular, for aerospace and avionics application fields, SRAM-based FPGAs are increasingly adopted for their configurability features making them a viable solution for long-time applications. However, these fields are characterized by a radiation environment that makes the technology extremely sensitive to radiation-induced Single Event Upsets (SEUs) in the SRAM-based FPGA's configuration memory. Configuration scrubbing and Triple Modular Redundancy (TMR) have been widely adopted in order to cope with SEU effects. However, modern FPGA devices are characterized by a heterogeneous routing resource distribution and a complex configuration memory mapping causing an increasing sensitivity to Cross Domain Errors affecting the TMR structure. In this paper we developed a new methodology to calculate the reliability of TMR architecture considering the intrinsic characteristics of the new generation of SRAM-based FPGAs. The method includes the analysis of the configuration bit sharing phenomena and of the routing long lines. We experimentally evaluate the method of various benchmark circuits evaluating the Mean Upset To Failure (MUTF). Finally, we used the results of the developed method to implement an improved design achieving 29× improvement of the MUTF.
机译:由于其高性能和设计灵活性,基于SRAM的FPGA代表了ASIC器件的低成本替代品。特别是,对于航空航天和航空电子设备应用领域,越来越多地采用基于SRAM的FPGA来实现可配置性功能,使其成为长期应用的可行解决方案。然而,这些字段的特征在于辐射环境,使技术对基于SRAM的FPGA配置存储器中的辐射引起的单个事件UPSET(SEU)非常敏感。通过广泛采用配置擦洗和三重模块化冗余(TMR)以应对SEU效果。然而,现代FPGA器件的特征在于异构路由资源分布和复杂的配置存储器映射,导致影响TMR结构的跨域误差的敏感性。在本文中,我们开发了一种新方法,以计算考虑到基于SRAM的新一代FPGA的内在特征的TMR架构的可靠性。该方法包括分析配置位共享现象和路由长线的分析。我们通过实验评估各种基准电路评估平均爆冷失败(MUTF)的方法。最后,我们使用了开发方法的结果,实现了改进的设计,实现了29×改善utf的改进。

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