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P-i-n diodes enabled by homoepitaxially grown phosphorus doped diamond with breakdown electric field >1.25 MV/cm

机译:由同质外延生长的磷掺杂金刚石实现的P-i-n二极管,其击穿电场> 1.25 MV / cm

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Owing to its rich material properties, such as high critical electric field, superior thermal conductivity and high electron and hole mobility, diamond has the potential of becoming the material of choice for high power electronic applications. In spite of superior bulk electrical and thermal properties, the only well-known use of diamond in power electronics has been as a heat sink. This is because of the lack of good quality homoepitaxially grown n-type diamond and also the difficulty involved in achieving ohmic contacts due to its very low-work function ( 0.9 eV)[1]. Although several approaches have been explored to obtain highly doped n-type diamond[2–4] very few have been successful [4–6]. In this presentation we report the successful fabrication and characterization of a p-i-n diode enabled by the development of low-resistance contacts to n-type diamond using Ti/Pt/Au metal contacts. This was made possible by a novel growth scheme where highly P-doped homoepitaxial diamond could be grown consistently.
机译:由于其丰富的材料特性,例如高临界电场,出色的导热性以及高电子和空穴迁移率,金刚石有潜力成为大功率电子应用的首选材料。尽管具有优异的整体电气和热性能,但在电力电子设备中,金刚石的唯一众所周知的用途是用作散热器。这是因为缺乏高质量的同质外延生长的n型金刚石,并且由于其功函数非常低(0.9 eV)而难以实现欧姆接触[1]。尽管已经探索了几种获得高掺杂n型金刚石的方法[2-4],但很少有成功的[4-6]。在本演讲中,我们报告了通过使用Ti / Pt / Au金属触点将低电阻触点开发为n型金刚石所实现的p-i-n二极管的成功制造和表征。这是通过一种新颖的生长方案得以实现的,在该方案中,高P掺杂同质外延金刚石可以一直生长。

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