首页> 外文会议>International Power Electronics Technology 2003 Conference; Nov 4-6, 2003; Long Beach, California >High Performance Intelligent Power Modules Using CSTBT Chips with Integrated Temperature Sensor
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High Performance Intelligent Power Modules Using CSTBT Chips with Integrated Temperature Sensor

机译:带有集成温度传感器的CSTBT芯片的高性能智能电源模块

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This paper describes a new family of intelligent power modules featuring the latest IGBT chip technology. These modules are targeted for all motor drive applications including general-purpose drives and multi-axis servo drives. The new IPMs feature compact packages designed for convenient installation. Fifth generation CSTBT (Carrier Stored Trench Bipolar Transistor) IGBT chips are utilized to provide low switching and conduction losses. The new chips are fabricated with an advanced on-chip temperature-sensing feature to provide effective over temperature protection against severe operating conditions. A new control circuit topology reduces EMI.
机译:本文介绍了采用最新IGBT芯片技术的新型智能电源模块系列。这些模块适用于所有电机驱动器应用,包括通用驱动器和多轴伺服驱动器。新的IPM具有紧凑的包装,旨在方便安装。第五代CSTBT(载流子沟道双极晶体管)IGBT芯片用于提供低开关损耗和传导损耗。新芯片具有先进的片上温度感测功能,可针对严酷的工作条件提供有效的过热保护。新的控制电路拓扑可降低EMI。

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