首页> 美国政府科技报告 >Integrated Finite-Element Generation for Intelligent Multichip Module ReliabilityAnalysis
【24h】

Integrated Finite-Element Generation for Intelligent Multichip Module ReliabilityAnalysis

机译:智能多芯片模块可靠性分析的集成有限元生成

获取原文

摘要

This report describes efforts to develop an integrated finite-element meshgeneration capability for the Rome Laboratory Intelligent Multichip Module Analyzer (IMCMA). IMCMA is a blackboard-based software tool that automatically applies finite-element and knowledge-based analysis to rapidly assess the thermal reliability of microelectronic multichip module (MCM) designs. IMCMA is a cooperative effort between Rome Laboratory, the Mechanical Engineering and Computer Science Departments at the University of Massachusetts, and Blackboard Technology Group, Inc. In IMCMA, the amount of modeling effort and expertise required of the designer has been reduced through: (1) use of a high-level representation of devices as the interface between the designer and the analysis tools; and (2) incorporating the modeling and analysis expertise of experienced design analysts into the software, making it available to less experienced designers. This was accomplished primarily by replacing modeling and mesh generation activities previously performed in IMCMA by software from Sandia National Laboratory with new, re4esigned, and tightly-integrated IMCMA software modules. A 3D-viewer for displaying analysis results (complementing the existing 2D display facility) was also designed and implemented, and the existing graphical user interface was extended and enhanced. This has resulted in an IMCMA that is smaller, faster, more flexible, more portable, more available, and more self-contained than its predecessor.

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号