首页> 外文会议>1994 international electronics packaging conference >FLIP CHIP ATTACHMENT USING NON-CONDUCTIVE ADHESIVES AND GOLD BALL BUMPS
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FLIP CHIP ATTACHMENT USING NON-CONDUCTIVE ADHESIVES AND GOLD BALL BUMPS

机译:使用非导电粘合剂和金球碰头的倒装芯片附件

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摘要

The interest in flip chip assemblies using adhesives for high density, fine pitch and high performance interconnections has increased rapidly. In this context we have developed a new flip chip technology using non-conductive adhesives in place of the traditional electrical adhesives. The concept is to simultaneously attach and electrically interconnect bare chips with gold stud bumps to many types of packaging substrates. By this novel interconnection method, the chip is bonded face down and is electrically connected via compressed and deformed gold ball bumps with the substrate. The chip is fixed by non-conductive adhesives which fill the entire gap between the die and packaging substrate.rnIn this investigation a non-conductive adhesive film was studied with an emphasis on the properties of COF (chip on flex) and COB (chip on board) interconnections. Electrical and mechanical performance of the adhesive bonds were studied by evaluating initial contact resistance and mechanical adhesion as a function of temperature and humidity. Both mechanical and electrical properties were measured before and after the environmental tests and compared to soldered contacts. For flip chip interconnects with a pad size of 100 μm square on the chip site and a contact area of ≈ 60 μm round, the resistance is less than 8 mΩ. This low contact resistance can be attributed to the special process and materials applied in this technology.rnMoreover, we investigated the bonding pressure, bonding temperature and time in comparison with the contact resistance. The results indicate that the control of these process parameters is a key factor for good bonding quality. Under the right processing conditions, non-conductive adhesive flip chip technique offers several important advantages over solder contacts.
机译:使用粘合剂实现高密度,细间距和高性能互连的倒装芯片组件的兴趣迅速增加。在这种情况下,我们开发了一种新的倒装芯片技术,该技术使用非导电粘合剂代替了传统的电气粘合剂。该概念是将带有金钉凸点的裸芯片同时附着和电气互连到许多类型的封装基板上。通过这种新颖的互连方法,芯片面朝下结合,并通过压缩和变形的金球凸块与基板电连接。芯片是通过不导电的粘合剂固定的,该粘合剂填充了芯片和封装基板之间的整个间隙。在这项研究中,研究了不导电的粘合剂膜,重点是COF(柔性芯片)和COB(柔性芯片)的性能。板)互连。通过评估初始接触电阻和机械粘附力随温度和湿度的变化,研究了粘合剂的电气和机械性能。在环境测试之前和之后都测量了机械性能和电气性能,并与焊接触点进行了比较。对于芯片位置上焊盘尺寸为100μm正方形,圆形接触面积约为60μm的倒装芯片互连,电阻小于8mΩ。这种低的接触电阻可以归因于该技术中使用的特殊工艺和材料。此外,我们还研究了与接触电阻相比的键合压力,键合温度和时间。结果表明,这些工艺参数的控制是获得良好粘合质量的关键因素。在适当的加工条件下,非导电粘合剂倒装芯片技术比焊接触点具有几个重要优势。

著录项

  • 来源
  • 会议地点 Atlanta GA(US)
  • 作者单位

    Technische Universitat Berlin Forschungsschwerpunkt Technologien der Mikroperipherik TIB 4/2-1 Gustav-Meyer-Allee 25 13355 Berlin, Germany;

    Frauenhofer-Einrichtung fur Zuverlassigkeit und Mikrointegration Gustav-Meyer-Allee 25 13355 Berlin, Germany;

    Frauenhofer-Einrichtung fur Zuverlassigkeit und Mikrointegration Gustav-Meyer-Allee 25 13355 Berlin, Germany;

    Frauenhofer-Einrichtung fur Zuverlassigkeit und Mikrointegration Gustav-Meyer-Allee 25 13355 Berlin, Germany;

    Technische Universitat Berlin Forschungsschwerpunkt Technologien der Mikroperipherik TIB 4/2-1 Gustav-Meyer-Allee 25 13355 Berlin, Germany;

  • 会议组织
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类 电真空器件制造工艺;
  • 关键词

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