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IEEE Electronic Components and Technology Conference

召开年：2018
召开地：San Diego(US)
出版时间：-

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1.Reliability Studies of Excimer Laser-Ablated Microvias Below 5 Micron Diameter in Dry Film Polymer Dielectrics for Next Generation, Panel-Scale 2.5D Interposer RDL

机译：下一代干膜聚合物介电层RDL中干膜聚合物电介质中准分子激光烧蚀直径小于5微米的微孔的可靠性研究
- 作者：Chandrasekharan Nair;Bartlet DeProspo;Habib Hichri;Markus Arendt;Fuhan Liu;Venky Sundaram;Rao Tummala
- 会议名称：《IEEE Electronic Components and Technology Conference》 | 2018年
- Dielectrics;
- Polymers;
- Copper;
- Reliability;
- Lasers;
- Resistance;
2.Reliability Study and Finite Element Modeling of a Wearable Sensor Patch (WSP) to Monitor ECG Signals

机译：用于监测ECG信号的可穿戴传感器补丁（WSP）的可靠性研究和有限元建模
- 作者：Mark Poliks;Varun Soman;James Turner;Mark Schadt;Michael Shay;Frank Egitto
- 会议名称：《IEEE Electronic Components and Technology Conference》 | 2018年
- TV;
- Substrates;
- Testing;
- Sensors;
- Integrated circuit reliability;
- Finite element analysis;
3.Reliability Study of Large Fan-Out BGA Solution on FinFET Process

机译：FinFET工艺上的大型扇出BGA解决方案的可靠性研究
- 作者：C.K. Yu;W.S. Chiang;P.S. Huang;M.Z. Lin;Y.H. Fang;M.J. Lin;Cooper Peng;Benson Lin;Michael Huang
- 会议名称：《IEEE Electronic Components and Technology Conference》 | 2018年
- Reliability;
- Substrates;
- Heating systems;
- Soldering;
- Integrated circuits;
- Stress;
- Resistance;
4.Reliability Test of Organic Substrate Processed by Newly Desmear Method 'PhotodesmearTM'

机译：通过新型去污方法“ PhotodesmearTM”处理的有机基材的可靠性测试
- 作者：Shinichi Endo;Tomoyuki Habu;Yasushi Muto;Shintaro Yabu
- 会议名称：《IEEE Electronic Components and Technology Conference》 | 2018年
- Humidity;
- Reliability;
- Tools;
- Life estimation;
- Stress;
- Radiation effects;
- Dielectrics;
5.RF Characterization, Analysis and Miniaturization Impact of RDL Interconnects

机译：RDL互连的射频特性，分析和微型化影响
- 作者：Hélène Jacquinot;Alexis Farcy;Thierry Lacrevaz;Kévin Morot;Bernard Flechet;Roselyne Ségaud;Rémi Velard;Lucile Arnaud;Jean-Charles Barbe;Lucile Cheramy
- 会议名称：《IEEE Electronic Components and Technology Conference》 | 2018年
- Substrates;
- Coplanar waveguides;
- Three-dimensional displays;
- Solid modeling;
- Resistance;
- Silicon;
6.Scaling Package Interconnects Below 20µm Pitch with Hybrid Bonding

机译：标称封装互连间距小于20µm，采用混合键合
- 作者：Guilian Gao;Laura Mirkarimi;Gill Fountain;Liang Wang;Cyprian Uzoh;Thomas Workman;Gabe Guevara;Chandrasekhar Mandalapu;Bongsub Lee;Rajesh Katkar
- 会议名称：《IEEE Electronic Components and Technology Conference》 | 2018年
- Bonding;
- Surface treatment;
- Annealing;
- Rough surfaces;
- Surface roughness;
- Standards;
7.Seal Rings Toughness Characterization by Numerical and Experimental Approaches

机译：密封环韧性的数值和实验方法表征
- 作者：Idir Raid;Sébastien Gallois-Garreignot;Rafael Estevez;Vincent Coutellier
- 会议名称：《IEEE Electronic Components and Technology Conference》 | 2018年
- Force;
- Delamination;
- Seals;
- Glass;
- Microscopy;
- Acoustics;
- Resistance;
8.Self-Assembly Technologies for FlexTrate™

机译：FlexTrate™的自组装技术
- 作者：Takafumi Fukushima;Yuki Susumago;Hisashi Kino;Tetsu Tanaka;Arsalan Alam;Amir Hanna;Subramanian Iyer
- 会议名称：《IEEE Electronic Components and Technology Conference》 | 2018年
- Self-assembly;
- Electronic components;
- Conferences;
- Fabrication;
- Electron devices;
9.Self-Powered, Inkjet Printed Electrochromic Films on Flexible and Stretchable Substrate for Wearable Electronics Applications

机译：柔性和可拉伸基材上的可穿戴电子应用的自供电，喷墨印刷电致变色膜
- 作者：Ebraheem Ali Azhar;Terry Alford;Hongbin Yu
- 会议名称：《IEEE Electronic Components and Technology Conference》 | 2018年
- Substrates;
- Nanoparticles;
- Performance evaluation;
- Electrochromic devices;
- Plastics;
- Photovoltaic systems;
10.Signal and Power Integrity Analysis of InFO Interconnect for Networking Application

机译：用于网络应用的InFO互连的信号和电源完整性分析
- 作者：Po-Hao Chang;Chia-Yuan Hsieh;Chun-Wei Chang;Chih-Lun Chuang;Chen-Feng Chiang
- 会议名称：《IEEE Electronic Components and Technology Conference》 | 2018年
- Impedance;
- Jitter;
- Timing;
- Integrated circuit modeling;
- Capacitors;
- Topology;
11.Simulation for Enhancing Automotive Power Module DBC Reliability During Assembly Process

机译：在组装过程中提高汽车功率模块DBC可靠性的仿真
- 作者：Yong Liu;Qiuxiao Qian
- 会议名称：《IEEE Electronic Components and Technology Conference》 | 2018年
- Cavity resonators;
- Pins;
- Lead;
- Ceramics;
- Bars;
- Clamps;
- Legged locomotion;
12.Single-Mode Optical Coupling Technology Using Movable Micro-Mirror Array and Surface-Emitting DFB Laser Array for High-Density 3-D Integration

机译：使用可移动微镜阵列和表面发射DFB激光阵列的单模光学耦合技术用于高密度3-D集成
- 作者：Takanori Suzuki;Koichiro Adachi;Yasunobu Matsuoka;Shigehisa Tanaka
- 会议名称：《IEEE Electronic Components and Technology Conference》 | 2018年
- Mirrors;
- Optical coupling;
- Optical arrays;
- Surface emitting lasers;
- Optical fibers;
- Springs;
13.Size and Shape Effect in the Determination of the Fracture Strength of Silicon Nitride in MEMS Structures at High Temperatures

机译：确定高温下MEMS结构中氮化硅断裂强度的尺寸和形状效应
- 作者：Alex Axel Navarrete Gonzalez;Eric Brace;Patricia Nieva
- 会议名称：《IEEE Electronic Components and Technology Conference》 | 2018年
- Shape;
- Temperature;
- Grippers;
- Substrates;
- Stress;
- Geometry;
- Temperature dependence;
14.Small Shielded Bluetooth Module Equipped with Slot Antenna on the Surface

机译：表面装有缝隙天线的小型屏蔽蓝牙模块
- 作者：Keiju Yamada;Makoto Sano;Makoto Higaki;Akihiko Happoya
- 会议名称：《IEEE Electronic Components and Technology Conference》 | 2018年
- Slot antennas;
- Antenna measurements;
- Wireless communication;
- Bluetooth;
- Antenna accessories;
- Prototypes;
15.Smart Packaging - Microscopic Temperature and Moisture Sensors Embedded in a Flip-Chip Package

机译：智能包装-倒装芯片封装中嵌入的微观温度和湿度传感器
- 作者：Aurore Quelennec;Yosri Ayadi;Quentin Vandier;Éric Duchesne;Hélène Frémont;Dominique Drouin
- 会议名称：《IEEE Electronic Components and Technology Conference》 | 2018年
- Temperature sensors;
- Temperature measurement;
- Moisture;
- Humidity;
- Reliability;
- Laminates;
16.Solder-Reflowable, High-Throughput Fiber Assembly Achieved by Partitioning of Adhesive Functions

机译：通过划分胶粘剂功能实现可回流焊接的高通量光纤组件
- 作者：Alexander Janta-Polczynski;Elaine Cyr;Richard Langlois;Paul Fortier;Yoichi Taira;Nicolas Boyer;Tymon Barwicz
- 会议名称：《IEEE Electronic Components and Technology Conference》 | 2018年
- Optical fiber couplers;
- Optical fiber devices;
- Optical coupling;
- Photonics;
- Tools;
17.Solderless Leadframe Assisted Wafer-Level Packaging Technology for Power Electronics

机译：电力电子的无焊引线框辅助晶圆级封装技术
- 作者：Kremena Vladimirova;Julie Widiez;Bastien Letowski;Pierre Perreau;Gregory Enyedi;Perceval Coudrain;Nicolas Rouger;Jean-Christophe Crebier
- 会议名称：《IEEE Electronic Components and Technology Conference》 | 2018年
- Three-dimensional displays;
- Lead;
- Switches;
- Copper;
- Electrodes;
- Bonding;
- Stacking;
18.Solely Calcine Controlled Ferroelectricity and Resistivity of Barium Titanate Thin Films and Their Advanced Memory Applications

机译：钛酸钡薄膜的完全煅烧控制的铁电和电阻率及其先进的存储应用
- 作者：Todd Schumann;Xiaochen Zhu;Jacob Neff;Arthur Hebard;Henry Zmuda;Yong-Kyu Yoon
- 会议名称：《IEEE Electronic Components and Technology Conference》 | 2018年
- Films;
- Schottky diodes;
- Memristors;
- Switches;
- Resistance;
- Market research;
- Lattices;
19.Surface Mount Electroosmotic Pump for Integrated Microfluidic Printed Circuit Boards

机译：用于集成微流控印刷电路板的表面安装电渗泵
- 作者：Sarkis Babikian;Makoto Jinsenji;Mark Bachman;G.P. Li
- 会议名称：《IEEE Electronic Components and Technology Conference》 | 2018年
- Microfluidics;
- Biomembranes;
- Micropumps;
- Substrates;
- Electrodes;
- Polymers;
20.Stacking Yield Prediction of Package-on-Package Considering the Statistical Distributions of Top/Bottom Package Warpages and Solder Ball Heights

机译：考虑顶部/底部包装翘曲和焊球高度的统计分布的堆叠包装堆叠产量预测
- 作者：Hsiu-Ping Wei;Bongtae Han
- 会议名称：《IEEE Electronic Components and Technology Conference》 | 2018年
- Electronic components;
- Conferences;
- Stochastic processes;
- Analytical models;
- Predictive models;
- Stacking;
21.Stretchable, Printable and Electrically Conductive Composites for Wearable RF Antennas

机译：用于可穿戴射频天线的可拉伸，可印刷和导电复合材料
- 作者：Bo Song;Fan Wu;Kyoung-sik Moon;Ryan Bahr;Manos Tentzeris;CP Wong
- 会议名称：《IEEE Electronic Components and Technology Conference》 | 2018年
- Silver;
- Conductivity;
- Polymers;
- Three-dimensional displays;
- Strain;
- Substrates;
- Tunneling;
22.Structuring Methods of Polymers for low Cost Sensor Manufacturing

机译：用于低成本传感器制造的聚合物的构造方法
- 作者：Sebastian Bengsch;Marc Christopher Wurz;Maximilian Aue;Sascha de Wall
- 会议名称：《IEEE Electronic Components and Technology Conference》 | 2018年
- Substrates;
- Injection molding;
- Manufacturing;
- Rough surfaces;
- Surface roughness;
- Surface treatment;
- Nickel;
23.Study of Advanced Fan-Out Packages for Mobile Applications

机译：用于移动应用的高级扇出封装的研究
- 作者：Taejoo Hwang;Dan Oh;Eunseok Song;Kilsoo Kim;Jaechoon Kim;Seokwon Lee
- 会议名称：《IEEE Electronic Components and Technology Conference》 | 2018年
- Thermal resistance;
- Performance evaluation;
- Bandwidth;
- Thermal management;
- Substrates;
24.Study of Interface Micro-Voids Between Sputter Cu Plating Cu: The Role of Photoresist

机译：溅射铜与镀铜之间的微孔界面研究：光刻胶的作用
- 作者：Y. B. Ou;T. L. Yang;W. C. Wu;B. T. Chen;K. Y. Lee;H. L. Huang;C. S. Liu;Ponder Pang;Edward Chen;K. C. Liu;Marvin Liao;Harry Ku
- 会议名称：《IEEE Electronic Components and Technology Conference》 | 2018年
- Resists;
- Current density;
- Surface treatment;
- Motion pictures;
- Legged locomotion;
- Reliability;
- Impurities;
25.Study of Polyimide in Chip Package Interaction for Flip-Chip Cu-Pillar Packages

机译：倒装芯片铜柱封装的芯片封装相互作用中的聚酰亚胺研究
- 作者：Wei Wang;Dingyou Zhang;Yangyang Sun;David Rae;Lily Zhao;Jiantao Zheng;Mark Schwarz;Milind Shah;Ahmer Syed
- 会议名称：《IEEE Electronic Components and Technology Conference》 | 2018年
- Stress;
- Passivation;
- Delamination;
- Thermal stresses;
- Polyimides;
- Flip-chip devices;
- Measurement;
26.Study of the Long Term Reliability of 3D IC under Near-Application Conditions

机译：接近应用条件下3D IC的长期可靠性研究
- 作者：Omar Ahmed;Golareh Jalilvand;Jessica Dieguez;Peng Su;Tengfei Jiang
- 会议名称：《IEEE Electronic Components and Technology Conference》 | 2018年
- High-temperature superconductors;
- Reliability;
- Three-dimensional displays;
- Testing;
- Integrated circuits;
- Stress;
- Nickel;
27.Study of Wearables with Embedded Electronics Through Experiments and Simulations

机译：通过实验和仿真研究嵌入式电子设备中的可穿戴设备
- 作者：Justin H. Chow;Suresh K. Sitaraman;Christopher May;Joseph May
- 会议名称：《IEEE Electronic Components and Technology Conference》 | 2018年
- Resistance;
- Yarn;
- Strain;
- Finite element analysis;
- Optical fiber sensors;
- Testing;
28.Study on an Improved Wafer Level Fabrication Process to Achieve Size Uniformity for Micro Glass Shell Resonators

机译：改进的晶圆级制造工艺以实现微玻璃壳谐振器尺寸均匀性的研究
- 作者：Zhaoxi Su;Jintang Shang;Bin Luo;Ching-Ping Wong
- 会议名称：《IEEE Electronic Components and Technology Conference》 | 2018年
- Electronic components;
- Conferences;
29.Supply-Chain Security Enhancement by Chaotic Wireless Chip-Package-Board Interactive PUF

机译：混沌无线芯片封装板交互式PUF增强了供应链的安全性
- 作者：Masanori Takahashi;Makoto Nagata;Noriyuki Miura
- 会议名称：《IEEE Electronic Components and Technology Conference》 | 2018年
- Electronic components;
- Conferences;
30.Suspended Microstrip Low-Pass Filter Realized Using FDM Type 3D Printing with Conductive Copper-Based Filament

机译：使用带导电铜基细丝的FDM 3D打印实现悬浮微带低通滤波器
- 作者：Ilona Piekarz;Jakub Sorocki;Krzysztof Wincza;Slawomir Gruszczynski;John Papapolymerou
- 会议名称：《IEEE Electronic Components and Technology Conference》 | 2018年
- Conductivity;
- Low pass filters;
- Microwave filters;
- Three-dimensional printing;
- Three-dimensional displays;
- Microstrip filters;
- Connectors;
31.Synthesis of a Graphene Carbon Nanotube Hybrid Film by Joule Self-Heating CVD for Thermal Applications

机译：焦耳自热CVD合成石墨烯碳纳米管杂化膜的热学应用
- 作者：Josef Hansson;Majid Kabiri Samani;Andreas Nylander;Lilei Ye;Nan Wang;Torbjörn Nilsson;Johan Liu
- 会议名称：《IEEE Electronic Components and Technology Conference》 | 2018年
- Graphene;
- Thermal resistance;
- Heating systems;
- Substrates;
- Thermal conductivity;
- Surface topography;
32.The Effect of the SnAg Solder Joint Morphology on the Thermal Cycle Reliability of 40 µm Fine-Pitch Cu-Pillar/SnAg Micro Bump Interconnection

机译：SnAg焊点形态对40 µm细间距Cu柱/ SnAg微凸点互连的热循环可靠性的影响
- 作者：SeYong Lee;HanMin Lee;JongHo Park;SangMyung Shin;WooJeong Kim;TaeJin Choi;Kyung-Wook Paik
- 会议名称：《IEEE Electronic Components and Technology Conference》 | 2018年
- Soldering;
- Morphology;
- Curing;
- Temperature measurement;
- Thermomechanical processes;
- Bonding;
- Reliability;
33.The Expermental and Numerical Study of Electromigration in 2.5D Packaging

机译：2.5D包装中电迁移的实验和数值研究
- 作者：Jiefeng Xu;Yuling Niu;Stephen R. Cain;Scott McCann;Ho Hyung Lee;Gamal Refai-Ahmed;S.B. Park
- 会议名称：《IEEE Electronic Components and Technology Conference》 | 2018年
- Current density;
- Anodes;
- Integrated circuit interconnections;
- Cathodes;
- Temperature;
- Lead;
- Mathematical model;
34.The Impact of Thermal Shrinkage of Glass Carriers on Achieving Fine Pitch Wiring Through Fan-Out WLP/PLP Process

机译：玻璃载体的热收缩对通过扇出WLP / PLP工艺实现细间距布线的影响
- 作者：Shuhei Nomura;Kazutaka Hayashi
- 会议名称：《IEEE Electronic Components and Technology Conference》 | 2018年
- Glass;
- Heat treatment;
- Temperature measurement;
- Substrates;
- Thermal stability;
- Temperature;
- Strain;
35.The Principles of 'Smart' Encapsulation: Using Additive Printing Technology for the Realization of Intelligent Application-Specific Packages for IoT, 5G, and Automotive Radar Applications

机译：“智能”封装的原理：使用增材印刷技术来实现针对IoT，5G和汽车雷达应用的特定于智能应用的包装
- 作者：Bijan Tehrani;Ryan Bahr;Daniel Revier;Benjamin Cook;Manos Tentzeris
- 会议名称：《》 | 2018年
- Three-dimensional displays;
- Three-dimensional printing;
- Microelectronics;
- Fabrication;
- Ink;
- Wireless communication;
36.The Reliability and the Effect of NCA Trapping in Thermo-Compression Flip-Chip Solder Joints Fabricated Using Sn-Ag Solder Capped 40 µm Pitch Cu Pillar Bumps and Low Temperature Curable Non-Conductive Adhesive (NCA)

机译：使用锡-银焊料覆盖的40μm间距铜柱凸点和低温可固化非导电胶（NCA）制成的热压倒装芯片焊点的NCA捕获可靠性和效果
- 作者：Hwan-Pil Park;Seongchul Kim;Taeyoung Lee;Sehoon Yoo;Young-Ho Kim;Jae-Yong Park Park
- 会议名称：《IEEE Electronic Components and Technology Conference》 | 2018年
- Bonding;
- Resistance;
- Reliability;
- Soldering;
- Rough surfaces;
- Surface roughness;
- Flip-chip devices;
37.The Stress State of BGA Solder Joints Influenced by the Grain Orientations of Neighboring Joints

机译：相邻接头晶粒取向对BGA焊点应力状态的影响
- 作者：Andreas Lövberg;Per-Erik Tegehall
- 会议名称：《IEEE Electronic Components and Technology Conference》 | 2018年
- Soldering;
- Strain;
- Creep;
- Fatigue;
- Stress;
- Lead;
- Tin;
38.Thermal and Electrical Characterization of TSV Interposer Embedded with Microchannel for 2.5D Integration of GaN RF Devices

机译：集成有微通道的TSV中介层的热和电特性，用于GaN RF器件的2.5D集成
- 作者：Han Cai;Shenglin Ma;Wei Wang;Yufeng Jin;Jing Chen;Jian Zhang;Weiwei Xiang;Liulin Hu;Shuwei He
- 会议名称：《IEEE Electronic Components and Technology Conference》 | 2018年
- Microchannels;
- Through-silicon vias;
- Cooling;
- Gallium nitride;
- Radio frequency;
- Silicon;
- Microfluidics;
39.Thermal Design and Characterization of High Power SiC Inverter with Low Profile and Enhanced Thermal Performance

机译：薄型化和增强热性能的大功率SiC逆变器的热设计和表征
- 作者：Gongyue Tang;Tai Chong Chai;Xiaowu Zhang
- 会议名称：《IEEE Electronic Components and Technology Conference》 | 2018年
- Substrates;
- Silicon carbide;
- Junctions;
- Electronic packaging thermal management;
- Heat sinks;
- Thermal resistance;
40.Thermal Stability of Cu/Co Metaconductor and Its Millimeter Wave Applications

机译：Cu / Co元导体的热稳定性及其在毫米波中的应用
- 作者：Timothy Clingenpeel;Seahee Hwangbo;Nicolas Garraud;David Arnold;Yong-Kyu Yoon
- 会议名称：《IEEE Electronic Components and Technology Conference》 | 2018年
- Magnetization;
- Magnetic fields;
- Metals;
- Magnetic hysteresis;
- Power transmission lines;
- Substrates;
41.Thermomechanical Properties of Fan-Out Wafer Level Package with Various Chip and Mold Thickness

机译：具有不同切屑和模具厚度的扇形晶圆级封装的热机械性能
- 作者：Haksan Jeong;Woo-Ram Myung;Kwang-Ho Jung;Seung-Boo Jung
- 会议名称：《IEEE Electronic Components and Technology Conference》 | 2018年
- Electronic components;
- Conferences;
42.Thick 3D Printed RF Components: Transmission Lines and Bandpass Filters

机译：厚3D打印的RF组件：传输线和带通滤波器
- 作者：Kyoung Youl Park;Mohd Ifwat Mohd Ghazali;Nophadon Wiwatcharagoses;Premjeet Chahal
- 会议名称：《IEEE Electronic Components and Technology Conference》 | 2018年
43.Thin Glass Based Optical Sub-Assemblies for Embedding in Electronic Systems

机译：嵌入电子系统的基于薄玻璃的光学子组件
- 作者：Gunnar Böttger;Henning Schröder;Martin Schneider-Ramelow;Klaus-Dieter Lang
- 会议名称：《IEEE Electronic Components and Technology Conference》 | 2018年
- Glass;
- Optical fibers;
- Optical fiber sensors;
- Optical coupling;
44.Three-Dimensional Simulation of Effects of Microstructure Evolution and Interfacial Delamination on Cu Protrusion in Copper Filled Through Silicon Vias by Combined Monte Carlo and Finite Element Methods

机译：蒙特卡罗和有限元相结合的三维模拟和微观组织演变对硅填充铜通孔中铜突起的影响的三维模拟
- 作者：Shui-Bao Liang;Chang-Bo Ke;Cheng Wei;Min-Bo Zhou;Xin-Ping Zhang
- 会议名称：《IEEE Electronic Components and Technology Conference》 | 2018年
- Through-silicon vias;
- Copper;
- Delamination;
- Microstructure;
- Stress;
- Finite element analysis;
- Solid modeling;
45.Through Glass Via (TGV) Based Band Pass Filter for 5G Communications

机译：基于玻璃通孔（TGV）的5G通信带通滤波器
- 作者：Renuka Bowrothu;Yong-Kyu Yoon;Jay Zhang
- 会议名称：《IEEE Electronic Components and Technology Conference》 | 2018年
- Substrates;
- Glass;
- Band-pass filters;
- Rough surfaces;
- Surface roughness;
- Resonant frequency;
- Skin;
46.Trend Plots for Different Mold-Thick Selection on Warpage Design of MUF FCCSP with 4L ETS

机译：带4L ETS的MUF FCCSP翘曲设计中不同型厚选择的趋势图
- 作者：Chih-Sung Chen;Nicholas Kao;Don Son Jiang
- 会议名称：《IEEE Electronic Components and Technology Conference》 | 2018年
- Compounds;
- Stress;
- Strain;
- Substrates;
- Copper;
- Conductors;
- Market research;
47.Transient Liquid Phase Bonding Using AgSn-Alloys for Stress Reduced Sensor Mounting

机译：使用AgSn合金进行瞬态液相键合以降低应力的传感器安装
- 作者：Markus Feißt;Jun Yu;Jüergen Wilde
- 会议名称：《IEEE Electronic Components and Technology Conference》 | 2018年
- Bonding;
- Strain;
- Stress;
- Surface treatment;
- Heating systems;
- Substrates;
- Temperature measurement;
48.Transient Liquid Phase Sintering Using Copper-Solder-Resin Composite for High-Temperature Power Modules

机译：铜-树脂-树脂复合材料用于高温功率模块的瞬态液相烧结
- 作者：Hiroaki Tatsumi;Adrian Lis;Takeshi Monodane;Hiroshi Yamaguchi;Yoshihiro Kashiba;Akio Hirose
- 会议名称：《IEEE Electronic Components and Technology Conference》 | 2018年
- Bonding;
- Multichip modules;
- Liquids;
- Transient analysis;
- Reliability;
- Substrates;
- Microstructure;
49.UBM/RDL Deposition by PVD for FOWLP in High Volume Production

机译：PVD的UBM / RDL沉积用于FOWLP的批量生产
- 作者：Chris Jones;Steve Burgess;Tony Wilby;Paul Densley
- 会议名称：《IEEE Electronic Components and Technology Conference》 | 2018年
- Metals;
- Throughput;
- Iterative closest point algorithm;
- Performance evaluation;
- Plasma temperature;
- Moisture;
- Silicon;
50.Ultra Fine RDL Structure Fabrication Using Alternative Patterning and Bottom-Up Plating Processes

机译：使用替代图案和自底向上电镀工艺的超精细RDL结构制造
- 作者：Richard Hollman;Ognian Dimov;Sanjay Malik;Habib Hichri;Markus Arendt
- 会议名称：《IEEE Electronic Components and Technology Conference》 | 2018年
- Plating;
- Polyimides;
- Laser ablation;
- Metals;
- Surface treatment;
- Filling;
- Fabrication;
51.Ultra-Compact, High-Performance, 3D-IPD Integrated Using Conformal 3D Interconnects

机译：使用保形3D互连集成的超紧凑，高性能3D-IPD
- 作者：Ayad Ghannam;Alessandro Magnani;David Bourrier;Thierry Parra
- 会议名称：《IEEE Electronic Components and Technology Conference》 | 2018年
- Three-dimensional displays;
- Inductors;
- Inductance;
- Solenoids;
- Glass;
- Substrates;
- Band-pass filters;
52.Ultra-Thin 50 um Fan-Out Wafer Level Package: Development of an Innovative Assembly and De-bonding Concept

机译：超薄的50 um扇出晶圆级封装：创新的组装和脱胶概念的发展
- 作者：Markus Woehrmann;Tanja Braun;Michael Toepper;Klaus-Dieter Land
- 会议名称：《IEEE Electronic Components and Technology Conference》 | 2018年
- Substrates;
- Electromagnetic compatibility;
- Glass;
- Routing;
- Steel;
- Compounds;
- Lasers;
53.Understanding the Impact of PCB Changes in the Latest Published JEDEC Board Level Drop Test Method

机译：在最新发布的JEDEC板级跌落测试方法中了解PCB更改的影响
- 作者：Varun Thukral;J.J.M. Zaal;R. Roucou;J. Jalink;R.T.H.. Rongen
- 会议名称：《IEEE Electronic Components and Technology Conference》 | 2018年
- Strain;
- Frequency measurement;
- Damping;
- Strain measurement;
- Soldering;
- Resonant frequency;
- Acceleration;
54.Understanding Underfill Degradation in Reliability Testing Conditions for ADAS Package Development

机译：了解用于ADAS封装开发的可靠性测试条件中的底部填充剂降解
- 作者：Ziyin Lin;Vijay Subramanian;Pramod Malatkar;Nisha Ananthakrishnan
- 会议名称：《IEEE Electronic Components and Technology Conference》 | 2018年
- Degradation;
- Materials reliability;
- Thermal stability;
- Stress;
- Thermal degradation;
- Temperature measurement;
55.Various Chip Attach Evaluations in a Fine Bump Pitch and Substrate Flip Chip Package

机译：精细凹凸间距和基板倒装芯片封装中的各种芯片连接评估
- 作者：ChiYuan Chen;Ian Hsu;Stanley Lin;KeonTaek Kang;Ming-Che Hsieh
- 会议名称：《IEEE Electronic Components and Technology Conference》 | 2018年
- Flip-chip devices;
- Substrates;
- Silicon;
- Bonding;
- Inspection;
- Reliability;
- Mobile applications;
56.Void-Free Copper Pillar Hybrid Wafer Bonding Using a BCB Based Polymer Adhesive and Chemical Mechanical Polishing

机译：使用基于BCB的聚合物粘合剂和化学机械抛光的无空隙铜柱混合晶圆键合
- 作者：Michael Gallagher;Julia Kozhukh;Matthew VanHanehem;Ed Anzures;Rosemary Bell;Masaki Kondo
- 会议名称：《IEEE Electronic Components and Technology Conference》 | 2018年
- Copper;
- Resins;
- Bonding;
- Slurries;
- Polymers;
- Micrometers;
- Viscosity;
57.Warpage Analysis with Newly Molding Material of Fan-Out Panel Level Packaging and the Board Level Reliability Test Results

机译：扇出面板级封装新成型材料的翘曲分析和板级可靠性测试结果
- 作者：Kazuhiro Kikuchi;Yuusuke Nedzu;Takashi Sugino
- 会议名称：《》 | 2018年
- Copper;
- Silicon;
- Substrates;
- Epoxy resins;
- Fabrication;
- Cavity resonators;
58.Warpage and Reliability Challenges for Stacked Silicon Interconnect Technology in Large Packages

机译：大包装堆叠式硅互连技术的翘曲和可靠性挑战
- 作者：Scott McCann;Ho Hyung Lee;Gamal Refai-Ahmed;Tom Lee;Suresh Ramalingam
- 会议名称：《IEEE Electronic Components and Technology Conference》 | 2018年
- Field programmable gate arrays;
- Substrates;
- Silicon;
- Temperature measurement;
- Stress;
- Reliability engineering;
59.Warpage and Thermal Stress under Thermal Cycling Test in SiC and Si Power Device Structures Using Direct Chip-Bonding with Ag Sintered Layer on Cu Plate

机译：使用Cu板上的Ag烧结层直接芯片键合的SiC和Si功率器件结构在热循环测试下的翘曲和热应力
- 作者：Masaki Kanemoto;Masaaki Aoki;Akihiro Mochizuki;Yoshio Murakami;Mutsuharu Tsunoda;Nobuhiko Nakano
- 会议名称：《IEEE Electronic Components and Technology Conference》 | 2018年
- Silicon carbide;
- Silicon;
- Stress;
- Thermal stresses;
- Semiconductor device measurement;
- Temperature measurement;
- Bonding;
60.Warpage Control During Mass Reflow Flip Chip Assembly Using Temporary Adhesive Bonding

机译：使用临时粘合剂键合进行质量回流倒装芯片组装期间的翘曲控制
- 作者：Normand-Pierre Goodhue;David Danovitch;Jeff Moussodji Moussodji;Benoit Papineau;Eric Duchesne
- 会议名称：《IEEE Electronic Components and Technology Conference》 | 2018年
- Substrates;
- Temperature measurement;
- Bonding;
- Polyimides;
- Semiconductor device measurement;
- Glass;
- Force;
61.Warpage Control of Liquid Molding Compound for Fan-Out Wafer Level Packaging

机译：扇形晶圆级包装用液态模塑料的翘曲控制
- 作者：Yosuke Oi;Yasuhito Fujii;Takashi Hiraoka;Yukio Yada;Katsushi Kan
- 会议名称：《IEEE Electronic Components and Technology Conference》 | 2018年
- Silicon;
- Curing;
- Compounds;
- Chemicals;
- Liquids;
- Volume measurement;
- Compression molding;
62.Warpage Measurements and Characterizations of Fan-Out Wafer-Level Packaging with Large Chips and Multiple Redistributed Layers

机译：具有大芯片和多个重新分布层的扇出晶圆级包装的翘曲测量和特性
- 作者：John Lau;Ming Li;Yang Lei;Margie Li;Iris Xu;Tony Chen;Sandy Chen;Qing Xiang Yong;Kumar Janardhanan;Wu Kai;Nelson Fan;Eric Kuah;Zhang Li;Kim Hwee Tan;Winsons Bao;Sze Pei Lim;Rozalia Beica;CT Ko;Cao Xi
- 会议名称：《IEEE Electronic Components and Technology Conference》 | 2018年
63.Water Effects in Polymers Through Molecular Dynamics

机译：高分子通过分子动力学对水的影响
- 作者：Nancy Iwamoto
- 会议名称：《IEEE Electronic Components and Technology Conference》 | 2018年
- Plastics;
- Adhesives;
- Moisture;
- Copper;
- Water;
- Market research;
- Mechanical factors;
64.Welcome Message from the General Chair and Program Chair

机译：主席和计划主席致欢迎辞
- 会议名称：《IEEE Electronic Components and Technology Conference》 | 2018年
65.Wet-Spun Graphene Sheets as Flexible Heat Spreaders for Efficient Thermal Management

机译：湿纺石墨烯片作为用于高效热管理的柔性散热器
- 作者：Guang Yang;Yuze Yan;Zhuo Li;Chaowei Li;Yagang Yao
- 会议名称：《IEEE Electronic Components and Technology Conference》 | 2018年
- Graphene;
- Thermal conductivity;
- Conductivity;
- Heating systems;
- Spinning;
- Coagulation;
66.Wide-Range 2D InP Chip-to-Fiber Alignment Through Bimorph Piezoelectric Actuators

机译：通过双压电晶片压电执行器进行大范围的2D InP芯片到光纤对准
- 作者：Simone Cardarelli;Nicola Calabretta;Ripalta Stabile;Kevin Williams;Xiao Luo;Jan Mink
- 会议名称：《IEEE Electronic Components and Technology Conference》 | 2018年
- Optical fibers;
- Optical fiber sensors;
- Optical coupling;
- Couplings;
- Actuators;
67.Wireless EAS Sensor Tags for Volatile Profiling in Food Packages

机译：无线EAS传感器标签，用于食品包装中的易失性分析
- 作者：Saranraj Karuppuswami;Mohd Ifwat Mohd Ghazali;Saikat Mondal;Premjeet Chahal
- 会议名称：《IEEE Electronic Components and Technology Conference》 | 2018年
- Coatings;
- Resonant frequency;
- Substrates;
- Methanol;
- Capacitors;
- Supply chains;
- Monitoring;