首页>外文期刊>Microelectronics international: Journal of ISHM--Europe, the Microelectronics Society--Europe

Microelectronics international: Journal of ISHM--Europe, the Microelectronics Society--Europe

SCIEI

中文名称：国际微电子学：ISHM杂志-欧洲，微电子学会-欧洲

ISSN：1356-5362
出版周期：-

发文量：400

期刊论文

热门论文

年度选择

更多>>

全选（0）

1.Analysis of warpage and residual stress in plastic ball grid array package after post mold cure

机译：模具后固化后塑料球栅阵列包装的翘曲和残余应力分析
- 作者：Yi S.;Lam T.M.
- 期刊名称：《Microelectronics international: Journal of ISHM--Europe, the Microelectronics Society--Europe》 | 2012年第3期
- Ball grid arrays;
- Microelectronics packaging;
- Plastics;
- Stress (materials);
- Thermal expansion;
2.Growth of InN thin films on different Si substrates at ambient temperature

机译：常温下在不同Si衬底上生长InN薄膜
- 作者：Maryam Amirhoseiny;Zainuriah Hassan;Sha Shiong Ng
- 期刊名称：《Microelectronics international: Journal of ISHM--Europe, the Microelectronics Society--Europe》 | 2013年第2期
- Reactive sputtering;
- InN;
- Silicon (110);
- Scanning electron microscope;
- X-ray diffraction;
- Films (states of matter);
- Radio frequency identification;
- Silicon;
3.Optimization of the reflow soldering process with multiple quality characteristics in ball grid array packaging by using the grey-based Taguchi method

机译：基于灰色的Taguchi方法优化球栅阵列包装中具有多种质量特征的回流焊接工艺
- 作者：Lau C.-S.;Abdullah M.Z.;Khor C.Y.
- 期刊名称：《Microelectronics international: Journal of ISHM--Europe, the Microelectronics Society--Europe》 | 2013年第3期
- Analysis of variance;
- Grey-based Taguchi method;
- Lead-free;
- Multi-physics Code Coupling Interface;
- Reflow soldering process;
- Soldering;
- Variance;
4.Three axial low temperature cofired ceramic accelerometer

机译：三轴低温共烧陶瓷加速度计
- 作者：Jurków D.
- 期刊名称：《Microelectronics international: Journal of ISHM--Europe, the Microelectronics Society--Europe》 | 2013年第3期
- Acceleration;
- Accelerometer;
- Design;
- DoE;
- Experiment;
- LTCC;
- Measurement;
- Sensor;
5.Thick film screen printed environmental and chemical sensor array reference electrodes suitable for subterranean and subaqueous deployments

机译：厚膜丝网印刷环境和化学传感器阵列参比电极，适用于地下和水下部署
- 作者：J.K. Atkinson;M. Glanc;M. Prakorbjanya;M. Sophocleous;R.P. Sion;E. Garcia-Breijo
- 期刊名称：《Microelectronics international: Journal of ISHM--Europe, the Microelectronics Society--Europe》 | 2013年第2期
- Reference electrodes;
- Thick-film sensors;
- Silver/silver chloride;
- Environmental sensors;
- Electrodes;
- Sensors;
6.Ku-band high power internally matched GaN HEMTs with 1.5 GHz bandwidth

机译：具有1.5 GHz带宽的Ku波段高功率内部匹配GaN HEMT
- 作者：Ge Q.;Liu X.;Chen X.;Luo W.;Liu G.
- 期刊名称：《Microelectronics international: Journal of ISHM--Europe, the Microelectronics Society--Europe》 | 2013年第1期
- Bandwidths;
- Compensated matching;
- Flat power;
- Ku-band;
- Power transistors;
7.Potentiality of polysilicon nanogap structure for label-free biomolecular detection

机译：多晶硅纳米间隙结构在无标记生物分子检测中的潜力
- 作者：T.S. Dhahi;U. Hashim;M.E. Ali
- 期刊名称：《Microelectronics international: Journal of ISHM--Europe, the Microelectronics Society--Europe》 | 2013年第2期
- Nanogap electrodes;
- Double-layer capacitance;
- Dielectric-based biomolecular detection;
- Silicon;
- Sensors;
8.Microwave studies by perturbation of Ag thick film microstrip ring resonator using superstrate of bismuth strontium manganites

机译：铋锶锰矿上层扰动银厚膜微带环谐振器的微波研究
- 作者：S.N. Mathad;R.N. Jadhav;Vijaya Puri
- 期刊名称：《Microelectronics international: Journal of ISHM--Europe, the Microelectronics Society--Europe》 | 2013年第2期
- Permittivity;
- Thick films;
- Ring resonator;
- Penetration depth;
- Films (states of matter);
9.Finite element analysis of thermal distributions of solder ball in flip chip ball grid array using ABAQUS

机译：使用ABAQUS的倒装芯片球栅阵列中焊球热分布的有限元分析
- 作者：Kar Y.B.;Talik N.A.;Sauli Z.;Fei J.S.;Retnasamy V.
- 期刊名称：《Microelectronics international: Journal of ISHM--Europe, the Microelectronics Society--Europe》 | 2013年第1期
- ABAQUS;
- Finite element analysis;
- Flip chip;
- Solder ball;
- Stress (materials);
- Thermal analysis;
10.Superior performance and reliability of copper wire ball bonding in laminate substrate based ball grid array

机译：铜基球焊在层压基板球栅阵列中的卓越性能和可靠性
- 作者：Gan C.L.;Classe F.;Hashim U.
- 期刊名称：《Microelectronics international: Journal of ISHM--Europe, the Microelectronics Society--Europe》 | 2013年第3期
11.Study on the fluid-structure interaction of flexible printed circuit board motherboard in personal computer casings

机译：柔性印刷电路板主板在个人计算机外壳中的流固耦合研究
- 作者：Leong W.C.;Abdullah M.Z.;Khor C.Y.;Ramdan D.
- 期刊名称：《Microelectronics international: Journal of ISHM--Europe, the Microelectronics Society--Europe》 | 2013年第3期
- Circuits;
- Computers;
- Deflection;
- Fluid-structure interaction;
- FPCB motherboard;
- PC casings;
- Stress;
12.Enhanced photovoltaic properties of solar cell based on ITO/PEDOT:PSS/ZnO:P3HT/Ag by an annealing treatment

机译：通过退火处理增强了基于ITO / PEDOT：PSS / ZnO：P3HT / Ag的太阳能电池的光伏性能
- 作者：Wang X.;Yu C.;Wu J.
- 期刊名称：《Microelectronics international: Journal of ISHM--Europe, the Microelectronics Society--Europe》 | 2013年第1期
- Annealing treatment;
- J-V curves;
- Photoelectric devices;
- Solar power;
- ZnO film;
- ZnO/P3HT interface;
13.Electronic device integrated with LTCC temperature stabilizer

机译：集成了LTCC温度稳定器的电子设备
- 作者：Jurków D.;Lis G.
- 期刊名称：《Microelectronics international: Journal of ISHM--Europe, the Microelectronics Society--Europe》 | 2013年第1期
- Amplifiers;
- Antenna;
- Ceramics;
- Controllers;
- Heaters;
- Low temperature cofired ceramics;
- Multilayer;
- Sensors;
- Stabilizers;
- Temperature;
14.Embedded passive device technology for wireless mobile devices

机译：用于无线移动设备的嵌入式无源设备技术
- 作者：Yi S.;Kim K.;Lee D.;Kim H.;Jung T.
- 期刊名称：《Microelectronics international: Journal of ISHM--Europe, the Microelectronics Society--Europe》 | 2013年第1期
- Band-pass filters;
- Embedded passive devices;
- Front-end modules;
- Mobile technology;
- Organic substrate manufacturing process;
- Substrates;
15.Thermal resistance studies of surface modified heat sink for 3W LED using transient curve

机译：利用瞬态曲线研究3W LED表面改性散热器的热阻
- 作者：Shanmugan Subramani;Teeba Nadarajah;Mutharasu Devarajan
- 期刊名称：《Microelectronics international: Journal of ISHM--Europe, the Microelectronics Society--Europe》 | 2013年第2期
16.Design of low-noise CMOS transimpedance amplifier

机译：低噪声CMOS跨阻放大器的设计
- 作者：Chuah J.H.;Holburn D.
- 期刊名称：《Microelectronics international: Journal of ISHM--Europe, the Microelectronics Society--Europe》 | 2013年第3期
17.Ionic contaminations level and cleaning flip chip BGA package via a new cleaning solvent technology

机译：离子污染水平和通过新的清洁溶剂技术清洁倒装芯片BGA封装
- 作者：Yap Boon Kar;Noor Azrina Talik;Zaliman Sauli;Foong Chee Seng;Tan Chou Yong;Vithyacharan Retnasamy
- 期刊名称：《Microelectronics international: Journal of ISHM--Europe, the Microelectronics Society--Europe》 | 2013年第2期
- Flip chip;
- lonic contaminations;
- Flux cleaning;
- Water-based solvent;
- Contamination;
- Decontamination;
- Solvents;
18.Study of frequency dependent electrical properties of ZnO nanorods

机译：ZnO纳米棒的频率相关电学特性研究
- 作者：Kashif M.;Hashim U.
- 期刊名称：《Microelectronics international: Journal of ISHM--Europe, the Microelectronics Society--Europe》 | 2013年第3期
- Dielectric;
- Dielectric properties;
- Electrical impedance;
- Impedance;
- Sol-gel;
- ZnO nanorods;
19.Microwave permittivity and permeability of Mg_xMn _((0.9-x))Al_(0.1)Zn_(0.8)Fe_(1.2)O_4 thick films using superstrate method

机译：Mg_xMn _（（0.9-x））Al_（0.1）Zn_（0.8）Fe_（1.2）O_4厚膜的微波介电常数和磁导率
- 作者：Kashid P.B.;Kulkarni D.C.;Surve V.G.;Puri V.
- 期刊名称：《Microelectronics international: Journal of ISHM--Europe, the Microelectronics Society--Europe》 | 2013年第1期
- EMC patch antenna;
- Films (states of matter);
- Microwave permittivity;
- Permeability;
- Screen printing;
- Spinel ferrite;
- Thick films;
20.Tin contamination in PQFN package and its effects on wire bondability

机译：PQFN封装中的锡污染及其对接线能力的影响
- 作者：Zong F.;Wang Z.-J.;Xu Y.-B.;Niu J.-Y.;Zhang H.-M.
- 期刊名称：《Microelectronics international: Journal of ISHM--Europe, the Microelectronics Society--Europe》 | 2013年第3期
- Bond integrity;
- Contamination;
- Contamination solution;
- PQFN package;
- Tin contamination;
- Wire bondability;
- Wires;
21.Thermal analysis of LED lamp with LTCC-COB package

机译：采用LTCC-COB封装的LED灯的热分析
- 作者：Lee C.K.;Ahn J.K.;Lee C.R.;Kim D.;Baek B.J.
- 期刊名称：《Microelectronics international: Journal of ISHM--Europe, the Microelectronics Society--Europe》 | 2013年第1期
- Ceramics;
- Chip on board (COB);
- Junction temperature;
- Low temperature co-fired ceramic (LTCC);
- Thermal conductivity;
- Thermal resistance;
22.Non-destructive quantitative phase analysis of an LTCC material

机译：LTCC材料的无损定量相分析
- 作者：Kostja Makarovi?;Anton Meden;Marko Hrovat;Darko Belavi?;Janez Holc;Marija Kosec
- 期刊名称：《Microelectronics international: Journal of ISHM--Europe, the Microelectronics Society--Europe》 | 2013年第2期
- LTCC;
- Glass-ceramic composite;
- X-ray powder diffraction;
- Phase analysis;
- Non-destructive;
- Chemical analysis;
- Materials;
23.Tape casting and properties of Pr_2O_3-doped ZnO multilayer varistors

机译：Pr_2O_3掺杂的ZnO多层压敏电阻的流延铸造和性能
- 作者：Jan Kulawik;Dorota Szwagierczak;Beata Synkiewicz
- 期刊名称：《Microelectronics international: Journal of ISHM--Europe, the Microelectronics Society--Europe》 | 2014年第3期
- Ceramics;
- Thick/thin film technology;
- LTCC;
- Multilayer varistors;
- Tape casting;
24.The effect of microwave radiation on polyvinyl chloride-graphite thick film resistors

机译：微波辐射对聚氯乙烯-石墨厚膜电阻器的影响
- 作者：Kandagaddla Venkatasubrahmanayam;Busi Ram Babu;Billa Poornaiah;Yarravarapu Srinivasa Rao
- 期刊名称：《Microelectronics international: Journal of ISHM--Europe, the Microelectronics Society--Europe》 | 2014年第2期
- Composition;
- Grain size;
- Microwave radiation;
- Polymer resistor;
25.Effects of wet-oxidized 4H-SiC annealed in HNO_3/H_2O vapour

机译：HNO_3 / H_2O蒸气中湿式氧化4H-SiC的效果
- 作者：Banu Poobalan;Jeong Hyun Moon;Sang-Cheol Kim;Sung-Jae Joo;Wook Bahng;In Ho Kang;Nam-Kyun Kim;Kuan Yew Cheong
- 期刊名称：《Microelectronics international: Journal of ISHM--Europe, the Microelectronics Society--Europe》 | 2014年第1期
- Semiconductor technology;
- Thick/thin film technology;
26.Ion-selective electrode made with LTCC (low temperature co-fired ceramics) technology

机译：采用LTCC（低温共烧陶瓷）技术制成的离子选择电极
- 作者：Karol Malecha;Marek Dawgul;Dorota Pijanowska
- 期刊名称：《Microelectronics international: Journal of ISHM--Europe, the Microelectronics Society--Europe》 | 2014年第3期
- Low temperature co-fired ceramics (LTCC);
- Thick-film sensor;
- Thick-film technology;
27.Control of tube parameters on SWCNT bundle interconnect delay and power dissipation

机译：控制SWCNT束互连延迟和功耗上的管参数
- 作者：Mayank Kumar Rai;Rajesh Khanna;Sankar Sarkar
- 期刊名称：《Microelectronics international: Journal of ISHM--Europe, the Microelectronics Society--Europe》 | 2014年第1期
- Interconnects;
- Carbon nanotubes;
- CNT bundle interconnect;
- Single-walled carbon nanotube;
- Very large-scale integration;
28.Characterization and applicability of Sm_(0.9)Sr_(0.1)CoO_(3-δ) in oxygen sensors

机译：Sm_（0.9）Sr_（0.1）CoO_（3-δ）在氧气传感器中的表征与适用性
- 作者：Katarina Cvejin;Libu Manjakkal;Jan Kulawik;Krzysztof Zaraska;Dorota Szwagierczak
- 期刊名称：《Microelectronics international: Journal of ISHM--Europe, the Microelectronics Society--Europe》 | 2014年第3期
29.LTCC/PZT accelerometer in SMD package

机译：采用SMD封装的LTCC / PZT加速度计
- 作者：Arkadiusz Dabrowski;Karl Elkjaer;Louise Borregaard;Tomasz Zawada;Leszek Golonka
- 期刊名称：《Microelectronics international: Journal of ISHM--Europe, the Microelectronics Society--Europe》 | 2014年第3期
- Accelerometer;
- Sensor;
- LTCC;
- Piezoelectricity;
- PZT;
- Bimorph transducer;
30.Evolution of photovoltaic solar modules dark properties after exposition to electrical reverse stress current inducing thermal effect

机译：暴露于电反向应力电流诱导热效应后光伏太阳能组件暗特性的演变
- 作者：Jihad Sidawi;Carine Zaraket;Roland Habchi;Nathalie Bassil;Chafic Salame;Michel Aillerie;Jean-Pierre Charles
- 期刊名称：《Microelectronics international: Journal of ISHM--Europe, the Microelectronics Society--Europe》 | 2014年第2期
31.Stack of solid oxide fuel cells

机译：固体氧化物燃料电池堆
- 作者：Barbara Dziurdzia;Zbigniew Magonski;Henryk Jankowski
- 期刊名称：《Microelectronics international: Journal of ISHM--Europe, the Microelectronics Society--Europe》 | 2014年第3期
- Thick/thin film technology;
- Microchannel;
- Fuel cell;
- SOFC;
- Stack of SOFCs;
32.Integrated high voltage boost converter with LC filter and charge pump

机译：集成高压升压转换器，带有LC滤波器和电荷泵
- 作者：Jung Woong Park;Munkhsuld Gendensuren;Ho-Yong Choi;Nam-soo Kim
- 期刊名称：《Microelectronics international: Journal of ISHM--Europe, the Microelectronics Society--Europe》 | 2014年第1期
- Integration;
- Boost converter;
- Charge pump;
- CMOS;
- Control stage;
33.Silicon nanowire fabrication Silicon trimming via shallow anisotropic etching

机译：硅纳米线制造通过浅层各向异性蚀刻进行硅修整
- 作者：Tijjani Adam;U. Hashim
- 期刊名称：《Microelectronics international: Journal of ISHM--Europe, the Microelectronics Society--Europe》 | 2014年第2期
- Silicon;
- Trimming;
- Shallow;
- Anisotropic;
- Etching;
- Silicon-on-insulator;
- Photolithography;
- Current-voltage;
- Semiconductor;
- ICP-RIE;
34.Wafer damage issue study by heavy Al wire wedge bonding

机译：重型铝丝楔形键合对晶圆损坏问题的研究
- 作者：Hanmin Zhang;Ming Hu;Fei Zong;Baoguan Yin;Denghong Ye;Qingchun He;Zhijie Wang
- 期刊名称：《Microelectronics international: Journal of ISHM--Europe, the Microelectronics Society--Europe》 | 2014年第2期
- PQFN package;
- Wafer damage;
- Wedge tool;
- Al buildup;
- FEA modeling;
- WDT;
35.Thermoelectric energy harvester fabricated in thick-film/LTCC technology

机译：采用厚膜/ LTCC技术制造的热电能量收集器
- 作者：Piotr Markowski
- 期刊名称：《Microelectronics international: Journal of ISHM--Europe, the Microelectronics Society--Europe》 | 2014年第3期
- LTCC;
- Energy harvester;
- Generator;
- Thermocouples;
- Thermoelectricity;
- Thick-film;
36.The tunnelling and electron injection reliabilities for FG transistors

机译：FG晶体管的隧穿和电子注入可靠性
- 作者：Bongani C. Mabuza;Saurabh Sinha
- 期刊名称：《Microelectronics international: Journal of ISHM--Europe, the Microelectronics Society--Europe》 | 2014年第2期
- CMOS switches;
- Electron traps;
- Floating gates;
- Nanoscale;
- Threshold voltage shift;
37.A high gain and high linearity class-AB power amplifier for WCDMA applications

机译：适用于WCDMA应用的高增益，高线性AB类功率放大器
- 作者：Harikrishnan Ramiah;U. Eswaran;J. Kanesan
- 期刊名称：《Microelectronics international: Journal of ISHM--Europe, the Microelectronics Society--Europe》 | 2014年第1期
- Micro-circuit technology;
- Semiconductor technology;
38.Dynamic reliability approach of chip scale package assembly under vibration environment

机译：振动环境下芯片级封装组装的动态可靠性方法
- 作者：Ping Yang;Xiusheng Tang;Yu Liu;Shuting Wang;Jianming Yang
- 期刊名称：《Microelectronics international: Journal of ISHM--Europe, the Microelectronics Society--Europe》 | 2014年第2期
- Reliability;
- Vibration;
- CSP assembly;
- Fatigue life;
39.RF characteristics of 0.13-μm NMOS transistors for millimeter-wave application

机译：用于毫米波应用的0.13-μmNMOS晶体管的RF特性
- 作者：Siti Maisurah Mohd Hassan;Yusman M. Yusof;Arjuna Marzuki;Nazif Emran Farid;Siti Amalina Enche Ab Rahim;Mohd Hafis M. Ali
- 期刊名称：《Microelectronics international: Journal of ISHM--Europe, the Microelectronics Society--Europe》 | 2014年第2期
- CMOS;
- Integrated circuits;
- Maximum oscillation frequency;
- Millimeter-wave;
- Radio frequency;
- Transistor;
- Finger width;
- Number of fingers;
- S-parameter;
- Maximum stable gain;
40.Influence of co-firing process condition on low temperature co-fired ceramics membrane deflection

机译：共烧工艺条件对低温共烧陶瓷膜变形的影响
- 作者：Dominik Jurk?w
- 期刊名称：《Microelectronics international: Journal of ISHM--Europe, the Microelectronics Society--Europe》 | 2014年第3期
- LTCC;
- Deformation;
- DoE;
- Membrane;
- Co-firing;
- Taguchi;
41.Electronic measurement system of foot plantar pressure

机译：足底压力电子测量系统
- 作者：Ewa Klimiec;Jacek Piekarski;Wies?aw Zaraska;Barabara Jasiewicz
- 期刊名称：《Microelectronics international: Journal of ISHM--Europe, the Microelectronics Society--Europe》 | 2014年第3期
- Thick/thin film technology;
- Thick/thin film sensors;
- Telemedicine;
- Foot working;
- PVDF sensors;
42.Connection of electronic and microelectronic modules

机译：电子和微电子模块的连接
- 作者：Josef Sandera
- 期刊名称：《Microelectronics international: Journal of ISHM--Europe, the Microelectronics Society--Europe》 | 2014年第2期
43.In situ polymerised polypyrrole films for sensors application

机译：用于传感器的原位聚合聚吡咯膜
- 作者：Monika Zawadzka;Jan Kulawik;Dorota Szwagierczak;Krzysztof Zaraska
- 期刊名称：《Microelectronics international: Journal of ISHM--Europe, the Microelectronics Society--Europe》 | 2014年第3期
- Volatile organic compounds sensors;
- In situ chemical polymerisation;
- Polypyrrole;
44.Dielectric properties of high-permittivity A_(2/3) CuTa_4O_(12) ceramics

机译：高介电常数A_（2/3）CuTa_4O_（12）陶瓷的介电性能
- 作者：Dorota Szwagierczak
- 期刊名称：《Microelectronics international: Journal of ISHM--Europe, the Microelectronics Society--Europe》 | 2014年第3期
- Ceramics;
- Dielectric properties;
- Internal barrier layer capacitor;
- Tantalates;
45.Future and technical considerations of gold wirebonding in semiconductor packaging - a technical review

机译：半导体封装中金线键合的未来和技术考虑-技术评论
- 作者：Chong Leong Gan;Francis Classe;Bak Lee Chan;Uda Hashim
- 期刊名称：《Microelectronics international: Journal of ISHM--Europe, the Microelectronics Society--Europe》 | 2014年第2期
- Thermosonic bonding;
- Au wirebonding;
- Cu wirebonding;
- Ag wirebonding;
- Semiconductor packaging;
46.Measurements of thermal resistance of power LEDs

机译：功率LED热阻的测量
- 作者：Krzysztof G?recki
- 期刊名称：《Microelectronics international: Journal of ISHM--Europe, the Microelectronics Society--Europe》 | 2014年第3期
- Measurements;
- Power LEDs;
- Thermal resistance;
- Solid state lighting;
- Self-heating;
- Thermal parameters;
47.Fabrication of a micro-cantilever gold plated beams array

机译：微悬臂镀金梁阵列的制作
- 作者：Said M.M. Kafumbe
- 期刊名称：《Microelectronics international: Journal of ISHM--Europe, the Microelectronics Society--Europe》 | 2014年第1期
48.Influence of firing process quality on dielectric constant of microwave LTCC substrates

机译：焙烧工艺质量对微波LTCC基板介电常数的影响
- 作者：Beata Barteczka;Piotr Slobodzian;Arkadiusz Dabrowski;Leszek Golonka
- 期刊名称：《Microelectronics international: Journal of ISHM--Europe, the Microelectronics Society--Europe》 | 2014年第3期
- Dielectric permittivity measurement;
- DP 951 characterization;
- DP 9K7 characterization;
- Firing process;
- LTCC technology;
49.Analysis of misalignment-induced deformation in three-dimensional semiconductor chip stacks

机译：三维半导体芯片堆叠中未对准引起的变形分析
- 作者：Richard W. fohnson;Yu-Lin Shen
- 期刊名称：《Microelectronics international: Journal of ISHM--Europe, the Microelectronics Society--Europe》 | 2014年第2期
- Stress;
- Deformation;
- Solder;
- Finite element analysis;
- 3D Microelectronic package;
- Through-silicon via;
- Intermetallic;
- Chip stack;
50.Comparison of LTCC inductors on different substrate configurations with PCB inductor

机译：LTCC电感器在不同基板配置下与PCB电感器的比较
- 作者：Andrea M. Maric;Goran J. Radosavljevic;Walter Smetana;Ljiljana D. Zivanov
- 期刊名称：《Microelectronics international: Journal of ISHM--Europe, the Microelectronics Society--Europe》 | 2014年第1期
- Ceramics;
- Microelectronics packaging;
- Thick/thin film technology;
51.Thermal diffusivity of NTC layers obtained with photoacoustic technique

机译：用光声技术获得的NTC层的热扩散率
- 作者：O. A. Aleksic;P. M. Nikolic;D. Lukovic;K. Radulovic;D. Vasiljevic Radovic;S. Savic
- 期刊名称：《Microelectronics international: Journal of ISHM--Europe, the Microelectronics Society--Europe》 | 2004年第1期
- films (states of matter);
- thermal diffusion;
52.Fourier and wavelet transform analysis of moire fringe patterns in electronic packaging

机译：电子包装中莫尔条纹图案的傅里叶和小波变换分析
- 作者：C.Y. Xiong;J Zhang;M Li;J Fang;S Yi
- 期刊名称：《Microelectronics international: Journal of ISHM--Europe, the Microelectronics Society--Europe》 | 2004年第2期
- fourier transforms;
- electronics industry;
- packaging;
53.The reliability assessment of flip chip components

机译：倒装芯片组件的可靠性评估
- 作者：C.Y. Huang
- 期刊名称：《Microelectronics international: Journal of ISHM--Europe, the Microelectronics Society--Europe》 | 2004年第2期
- electronics industry;
- packaging;
- printed-circuit boards;
- product reliability;
54.Increasing placement capacity with area based optimization and line balancing

机译：通过基于面积的优化和线平衡来增加贴装容量
- 作者：Timo Liukkonen;Aulis Tuominen
- 期刊名称：《Microelectronics international: Journal of ISHM--Europe, the Microelectronics Society--Europe》 | 2004年第2期
- electronics industry;
- printed-circuit boards;
- assembly;
- optimization techniques;
55.Prediction of temperature in silicon chip with non-uniform power: a Lagrangian interpolation approach

机译：功率不均匀的硅芯片温度预测：拉格朗日插值法
- 作者：Teck Joo Goh;K.N. Seetharamu;G.A. Quadir;Z.A. Zainal;K Jeevan
- 期刊名称：《Microelectronics international: Journal of ISHM--Europe, the Microelectronics Society--Europe》 | 2004年第2期
- heat transfer;
- microprocessor chips;
- temperature distribution;
- interpolation;
56.A review of low-power wireless sensor microsystems for biomedical capsule diagnosis

机译：用于生物医学胶囊诊断的低功率无线传感器微系统综述
- 作者：Arshak K;Jafer E;Lyons G;Morris D;Korostynska O
- 期刊名称：《Microelectronics international: Journal of ISHM--Europe, the Microelectronics Society--Europe》 | 2004年第3期
- microsensors;
- biocomputers;
- systems engineering;
- SYSTEM;
- INTERFACE;
57.Interpolation of numerically computed potential using finite element approach

机译：使用有限元方法对数值计算的电位进行插值
- 作者：Maqsood A. Chaudhry
- 期刊名称：《Microelectronics international: Journal of ISHM--Europe, the Microelectronics Society--Europe》 | 2004年第1期
- finite element analysis;
- finite difference methods;
- resistors;
58.Thermal investigations of microelectronic chip with non-uniform power distribution: temperature prediction and thermal placement design optimization

机译：功率分布不均匀的微电子芯片的热研究：温度预测和热放置设计优化
- 作者：Goh TJ;Seetharamu KN;Quadir GA;Zainal ZA;Ganeshamoorthy KJ
- 期刊名称：《Microelectronics international: Journal of ISHM--Europe, the Microelectronics Society--Europe》 | 2004年第3期
- programming and algorithm theory;
- finite element analysis;
- regression analysis;
- dissipation factor;
59.Thick film PN-junetions based on mixed oxides of indium and silicon as gamma radiation sensors

机译：基于铟和硅的混合氧化物作为γ辐射传感器的厚膜PN结
- 作者：Khalil Arshak;Olga Korostynska;John Henry
- 期刊名称：《Microelectronics international: Journal of ISHM--Europe, the Microelectronics Society--Europe》 | 2004年第1期
- films (states of matter);
- oxides;
- gamma radiation;
60.Thermal degradation of joined thick Au and Al elements

机译：结合的厚金和铝元素的热降解
- 作者：A. Bochenek;B. Bober;W. Hauffe;M. Lukaszewicz;E. Langer
- 期刊名称：《Microelectronics international: Journal of ISHM--Europe, the Microelectronics Society--Europe》 | 2004年第1期
- thermal efficiency;
- electrical resistivity;
61.2D analysis of functional stress degradations on power VDMOS transistor

机译：功率VDMOS晶体管的功能应力退化的二维分析
- 作者：B Beydoun;M Zoaeter;A Alaeddine;I Rachidi;F Bahsoun;J-J. Charlot;J-P. Charles
- 期刊名称：《Microelectronics international: Journal of ISHM--Europe, the Microelectronics Society--Europe》 | 2004年第2期
- electrical properties of materials;
- semiconductor devices;
- stress (materials);
62.Geometrical and electrical properties of LTCC and thick-film microresistors

机译：LTCC和厚膜微电阻的几何和电性能
- 作者：Andrzej Dziedzic;Edward Mis;Lars Rebenklau;Klaus-Jurgen Wolter
- 期刊名称：《Microelectronics international: Journal of ISHM--Europe, the Microelectronics Society--Europe》 | 2005年第1期
- Resistors;
- Films (States of Matter);
- Electric Fields;
63.Repeater insertion in global interconnects in VLSI circuits

机译：在VLSI电路的全局互连中插入中继器
- 作者：Rajeevan Chandel;S. Sarkar;R. P. Agarwal
- 期刊名称：《Microelectronics international: Journal of ISHM--Europe, the Microelectronics Society--Europe》 | 2005年第1期
- Circuit Properties;
- Electronically Operated Devices;
- Voltage;
64.Effects of MOSFET mismatch on the performance of single supply low voltage operational amplifiers

机译：MOSFET不匹配对单电源低压运算放大器性能的影响
- 作者：Ramakrishnan R;Chaudhry MA
- 期刊名称：《Microelectronics international: Journal of ISHM--Europe, the Microelectronics Society--Europe》 | 2005年第3期
- printed circuits;
- design;
- voltage;
- amplifiers;
- MATCHING PROPERTIES;
- ANALOG DESIGN;
- MODEL;
- TRANSISTORS;
65.Thermal deformation analysis of BGA package by digital image correlation technique

机译：利用数字图像相关技术分析BGA封装的热变形
- 作者：J. Zhang;M. Li;C. Y. Xiong;J. Fang;S. Yi
- 期刊名称：《Microelectronics international: Journal of ISHM--Europe, the Microelectronics Society--Europe》 | 2005年第1期
- Stress (Materials);
- Deformation;
- Electronics Industry;
- Packaging;
66.Realizing high-voltage thin film lateral bipolar transistors on SOI with a collector-tub

机译：使用集电极管在SOI上实现高压薄膜横向双极晶体管
- 作者：Sukhendu Deb Roy;M Jagadesh Kumar
- 期刊名称：《Microelectronics international: Journal of ISHM--Europe, the Microelectronics Society--Europe》 | 2005年第1期
- Bipolar Transistors;
- Breakdown Voltage;
- Simulation;
67.Thick/thin film thermocouples as power source for autonomous microsystems - preliminary results

机译：厚膜/薄膜热电偶作为自主微系统的电源-初步结果
- 作者：Markowski P;Dziedzic A;Prociow E
- 期刊名称：《Microelectronics international: Journal of ISHM--Europe, the Microelectronics Society--Europe》 | 2005年第2期
- electric power systems;
- thermoelectric devices;
- SENSOR;
68.Optimization of fins used in electronic packaging

机译：优化电子包装中使用的散热片
- 作者：Kang Eu Ong;Kor Oon Lee;K. N. Seetharamu;I. A. Azid;G. A. Quadir;Z. A. Zainal;Teck Joo Goh
- 期刊名称：《Microelectronics international: Journal of ISHM--Europe, the Microelectronics Society--Europe》 | 2005年第1期
- Programming and Algorithm Theory;
- Optimization Techniques;
- Electronics Industry;
- Heat Transfer;
69.Chip packaging challenges ... a roadmap based overview

机译：芯片封装挑战...基于路线图的概述
- 作者：Longford A
- 期刊名称：《Microelectronics international: Journal of ISHM--Europe, the Microelectronics Society--Europe》 | 2005年第2期
- electronics industry;
- semiconductor technology;
70.Flexible electronics: silicon meets paper and beyond

机译：灵活的电子产品：硅遇到了纸和其他领域
- 作者：Whitmarsh J
- 期刊名称：《Microelectronics international: Journal of ISHM--Europe, the Microelectronics Society--Europe》 | 2005年第3期
- electronics industry;
- printed circuits;
- flexible manufacturing systems;
- emergent strategy;
71.Study of avalanche breakdown (MI) mode in sub micron MOSFET device

机译：亚微米MOSFET器件的雪崩击穿（MI）模式研究
- 作者：A. K. Singh
- 期刊名称：《Microelectronics international: Journal of ISHM--Europe, the Microelectronics Society--Europe》 | 2005年第1期
- Electronically Operated Devices;
- Transistors;
- Breakdown Voltage;
72.Delamination and solder flow-out in underfilled and Pb-free flip chips on laminate

机译：层压板上底部填充且无铅的倒装芯片中的分层和焊料流出
- 作者：van Kleef M;Bielen E;Gulpen A;Ramos M
- 期刊名称：《Microelectronics international: Journal of ISHM--Europe, the Microelectronics Society--Europe》 | 2005年第2期
- laminates;
- solder;
- moisture measurement;
73.Reliability assessment for SnPb solder and Ag-Pd bond pad metallization

机译：SnPb焊料和Ag-Pd焊盘金属化的可靠性评估
- 作者：Teo KC;Ting YL
- 期刊名称：《Microelectronics international: Journal of ISHM--Europe, the Microelectronics Society--Europe》 | 2005年第2期
- solders;
- tests and testing;
- temperature measurement;
74.Size dependent leaf overlay effects on thin film microstrip patch antenna

机译：取决于尺寸的叶片覆盖对薄膜微带贴片天线的影响
- 作者：Vijaya Puri;S. M. Salunkhe;M. M. Puranik
- 期刊名称：《Microelectronics international: Journal of ISHM--Europe, the Microelectronics Society--Europe》 | 2005年第1期
- Thin Films;
- Moisture;
- Microwaves;
- Sensors;
75.Thermal management of multi-chip module and printed circuit board using FEM and genetic algorithms

机译：利用有限元和遗传算法对多芯片模块和印刷电路板进行热管理
- 作者：Jeevan K;Quadir GA;Seetharamu KN;Azid IA
- 期刊名称：《Microelectronics international: Journal of ISHM--Europe, the Microelectronics Society--Europe》 | 2005年第3期
- finite element analysis;
- printed-circuit boards;
- programming and algorithm theory;
- PLACEMENT;
- DESIGN;
76.Properties of PZT thick films made on LTCC

机译：在LTCC上制造的PZT厚膜的性能
- 作者：Golonka LJ;Buczek M;Hrovat M;Belavic D;Dziedzic A;Roguszczak H;Zawada T
- 期刊名称：《Microelectronics international: Journal of ISHM--Europe, the Microelectronics Society--Europe》 | 2005年第2期
- thick-film circuits;
- actuators;
- electrical properties;
77.Performance exploration of adder architectures for small to moderate-sized low-power, high-performance adders

机译：中小型低功耗，高性能加法器的加法器架构的性能探索
- 作者：Gupta A;Shekhar C
- 期刊名称：《Microelectronics international: Journal of ISHM--Europe, the Microelectronics Society--Europe》 | 2005年第3期
- modelling;
- printed circuits;
- structural analysis;
- design and theory;
- CMOS FULL ADDER;
- DESIGN;
78.Delay analysis of a single voltage-scaled-repeater driven long interconnect

机译：单电压缩放中继器驱动的长互连的延迟分析
- 作者：Chandel R;Sarkar S;Agarwal RP
- 期刊名称：《Microelectronics international: Journal of ISHM--Europe, the Microelectronics Society--Europe》 | 2005年第3期
- printed circuits;
- voltage;
- electric power systems;
- POWER;
- MODEL;
- INDUCTANCE;
- INSERTION;
79.A faster power MOSFET device with electrical stress treatment

机译：具有电应力处理的更快功率MOSFET器件
- 作者：Salame C;Habchi R;Tazibt W;Khoury A;Mialhe P
- 期刊名称：《Microelectronics international: Journal of ISHM--Europe, the Microelectronics Society--Europe》 | 2005年第2期
- stress (materials);
- semiconductors;
- HOT-CARRIER DEGRADATION;
- BREAKDOWN;
- MECHANISMS;
- PREDICTION;
- LAYERS;
80.A 3D miniaturised programmable transceiver

机译：3D微型可编程收发器
- 作者：OFlynn B;Bellis S;Mahmood K;Morris M;Duffy G;Delaney K;OMathuna C
- 期刊名称：《Microelectronics international: Journal of ISHM--Europe, the Microelectronics Society--Europe》 | 2005年第2期
- sensors;
- transceivers;
- electric power transmission;
81.Transition time considerations in repeater-chains

机译：中继器链中的过渡时间注意事项
- 作者：Chandel R;Sarkar S;Agarwal RP
- 期刊名称：《Microelectronics international: Journal of ISHM--Europe, the Microelectronics Society--Europe》 | 2005年第3期
- printed circuits;
- simulation;
- signal generators;
- VLSI CIRCUITS;
- POWER;
- INTERCONNECTS;
- INSERTION;
- DELAY;
82.Optimization of a photo resists coating process for photolithography in wafer manufacturing via design of experiments method

机译：通过设计实验方法来优化晶圆制造中光刻的光刻胶涂层工艺
- 作者：Yang YK
- 期刊名称：《Microelectronics international: Journal of ISHM--Europe, the Microelectronics Society--Europe》 | 2006年第3期
- optimization techniques;
- coatings;
- photoresists;
83.Temperature dependence of silicon power MOSFETs switching parameters

机译：硅功率MOSFET的温度依赖性开关参数
- 作者：Habchi R;Salame C;Nsouli B;Mialhe P
- 期刊名称：《Microelectronics international: Journal of ISHM--Europe, the Microelectronics Society--Europe》 | 2006年第2期
- temperature;
- field-effect transistors;
- electric current;
- THRESHOLD VOLTAGE;
- FILMS;
84.Application of artificial intelligence for the determination of packaqe parameters for a desired solder joint fatigue life

机译：人工智能在确定期望焊点疲劳寿命的包装参数中的应用
- 作者：Lee KO;Ong KE;Seetharamu KN;Azid IA;Quadir GA;Goh TJ
- 期刊名称：《Microelectronics international: Journal of ISHM--Europe, the Microelectronics Society--Europe》 | 2006年第2期
- solders;
- joining materials;
- reliability management;
85.Comparison of different structures of ferrite EMI suppressors

机译：铁氧体电磁干扰抑制器不同结构的比较
- 作者：Damnjanovic M;Stojanovic G;Zivanov L;Desnica V
- 期刊名称：《Microelectronics international: Journal of ISHM--Europe, the Microelectronics Society--Europe》 | 2006年第3期
- electromagnetism;
- attenuators;
- INDUCTORS;
86.Uprating of electronic parts to address obsolescence

机译：升级电子零件以解决过时的问题
- 作者：Pecht M;Humphrey D
- 期刊名称：《Microelectronics international: Journal of ISHM--Europe, the Microelectronics Society--Europe》 | 2006年第2期
- obsolescence;
- electronic equipment and components;
- semiconductors;
- SPECIFIED TEMPERATURE-RANGES;
- MANAGEMENT;
- SELECTION;
- CRITERIA;
87.Impact of technology on PLL power and frequency

机译：技术对PLL功率和频率的影响
- 作者：Sulaiman MS
- 期刊名称：《Microelectronics international: Journal of ISHM--Europe, the Microelectronics Society--Europe》 | 2006年第3期
- electronic engineering;
- radiofrequencies;
- design;
- transceivers;
88.Impact of environmental regulations on green electronics manufacture

机译：环境法规对绿色电子制造的影响
- 作者：Ciocci R;Pecht M
- 期刊名称：《Microelectronics international: Journal of ISHM--Europe, the Microelectronics Society--Europe》 | 2006年第2期
- environmental management;
- electronics industry;
89.Low power critical voltage transition logic

机译：低功耗临界电压转换逻辑
- 作者：Chan YH;Lim CC;Lau KT;Foo SH
- 期刊名称：《Microelectronics international: Journal of ISHM--Europe, the Microelectronics Society--Europe》 | 2006年第3期
- circuit networks;
- design;
90.Low voltage high performance CCII for analog signal processing applications

机译：适用于模拟信号处理应用的低压高性能CCII
- 作者：Rajput SS;Jamuar SS
- 期刊名称：《Microelectronics international: Journal of ISHM--Europe, the Microelectronics Society--Europe》 | 2006年第1期
- low voltage;
- performance measures;
- analogue integrated circuits;
- CURRENT CONVEYOR;
- LOW-POWER;
91.Silicon-on-insulator lateral dual sidewall Schottky (SOI-LDSS) concept for improved rectifier performance: a two-dimensional simulation study

机译：绝缘体上硅横向双侧壁肖特基（SOI-LDSS）概念，用于改善整流器性能：二维仿真研究
- 作者：Kumar MJ;Reddy CL
- 期刊名称：《Microelectronics international: Journal of ISHM--Europe, the Microelectronics Society--Europe》 | 2006年第1期
- semiconductor devices;
- silicon;
- simulation;
- BREAKDOWN VOLTAGE;
- REVERSE CHARACTERISTICS;
- TMBS RECTIFIER;
- LMDS RECTIFIER;
- EXCELLENT;
- DEVICE;
92.A study of aluminium wire failure in automotive under-hood applications

机译：汽车引擎盖下铝线失效的研究
- 作者：Yi S;Park SK;Teo KC
- 期刊名称：《Microelectronics international: Journal of ISHM--Europe, the Microelectronics Society--Europe》 | 2006年第2期
- automotive industry;
- product reliability;
- electronic equipment and components;
93.Simulation of ideal grounded tunable inductor and its application in high quality multifunctional filter

机译：理想接地可调电感器的仿真及其在高质量多功能滤波器中的应用
- 作者：Parveen T;Ahmed MT
- 期刊名称：《Microelectronics international: Journal of ISHM--Europe, the Microelectronics Society--Europe》 | 2006年第3期
- circuit networks;
- controllers;
- simulation;
- electric filters;
- CURRENT-CONTROLLED CONVEYOR;
94.Test chip and substrate design for flip chip microelectronic package thermal measurements

机译：用于倒装芯片微电子封装热测量的测试芯片和基板设计
- 作者：Goh TJ;Chiu CP;Seetharamu KN;Quadir GA;Zainal ZA
- 期刊名称：《Microelectronics international: Journal of ISHM--Europe, the Microelectronics Society--Europe》 | 2006年第2期
- finite element analysis;
- thermal testing;
- tests and testing;
- printed circuits;
95.Thermal analysis of LED package

机译：LED封装的热分析
- 作者：Karim NAA;Narayana PA;Seetharamu KN
- 期刊名称：《Microelectronics international: Journal of ISHM--Europe, the Microelectronics Society--Europe》 | 2006年第1期
- light-emitting diodes;
- thermal efficiency;
- simulation;
96.Low voltage CCII-based high performance cascadable multifunctional filter

机译：基于低压CCII的高性能可级联多功能滤波器
- 作者：Parveen T;Rajput SS;Ahmad MT
- 期刊名称：《Microelectronics international: Journal of ISHM--Europe, the Microelectronics Society--Europe》 | 2006年第2期
- electric filters;
- low voltage;
- circuit properties;
- HIGH-INPUT IMPEDANCE;
- BIQUADRATIC FILTERS;
- CURRENT CONVEYOR;
97.Numerical analysis of PBG via structures using FDTD algorithm

机译：使用FDTD算法对结构进行PBG的数值分析
- 作者：Tong MS;Chen YC;Lu YL;Kim HS;Chang TG;Sauleau R
- 期刊名称：《Microelectronics international: Journal of ISHM--Europe, the Microelectronics Society--Europe》 | 2006年第1期
98.Crosstalk analysis and repeater insertion in crosstalk aware coupled VLSI interconnects

机译：具备串扰意识的耦合VLSI互连中的串扰分析和中继器插入
- 作者：Kaushik BK;Sarkar S;Agarwal RP;Joshi RC
- 期刊名称：《Microelectronics international: Journal of ISHM--Europe, the Microelectronics Society--Europe》 | 2006年第3期
- inductance;
- electrical connections;
- DELAY;
- INDUCTANCE;
- CIRCUITS;
99.Volume air flow sensors based on NTC thick film segmented thermistors

机译：基于NTC厚膜分段热敏电阻的风量传感器
- 作者：Obrad SA;Pantelija NM;Konstantinos PA
- 期刊名称：《Microelectronics international: Journal of ISHM--Europe, the Microelectronics Society--Europe》 | 2006年第3期
- sensors;
- flow;
- films (states of matter);
- THERMAL-DIFFUSIVITY;
100.Thick-film strain and temperature sensors on LTCC substrates

机译：LTCC基板上的厚膜应变和温度传感器
- 作者：Hrovat M;Belavic D;Kita J;Holc J;Drnovsek S;Cilensek J;Golonka L;Dziedzic A
- 期刊名称：《Microelectronics international: Journal of ISHM--Europe, the Microelectronics Society--Europe》 | 2006年第3期
- films (states of matter);
- substrates;
- electrical conductivity;
- EQUAL-TO 1;
- ELECTRICAL-PROPERTIES;
- NTC THERMISTORS;
- GAUGE APPLICATIONS;
- RESISTORS;
- COEFFICIENT;
- SENSITIVITY;
- CERAMICS;
- OXIDE;
- NI;

客服邮箱：kefu@zhangqiaokeyan.com

客服微信
服务号