METHOD OF MANUFACTURING MULTI-LAYER PRINTED CIRCUIT BOARD AND MULTI-LAYER PRINTED CIRCUIT BOARD MANUFACTURED BY THE METHOD

摘要

Disclosed are a method of manufacturing a multilayer printed circuit board and a multilayer printed circuit board manufactured according to the method. The manufacturing method of the multilayer printed circuit board includes (a) a copper clad laminate and a prepreg layer including a resin on the copper clad laminate each alternately n times, and the n-th prepreg Manufacturing a laminate including the (n+1)-th copper clad laminate on the layer; (b) compressing the laminate at _{a first temperature (T 1} ) lower than a glass transition temperature (Tg) of the resin; (c) _{compressing the laminate compressed at T 1} at a second temperature (T ₂ ) equal to or higher than Tg; (d) _{compressing the laminate compressed at T 2at a third temperature (T 3} ) lower than the Tg and higher than room temperature; And (e) _{lowering the temperature of the laminate compressed at T 3} to room temperature; and, n may be any one of 1 to 100 natural numbers. The method of manufacturing a multilayer printed circuit board according to the present invention has the effect of minimizing distortion of the multilayer PCB and leakage of prepregs by performing a pressing process in multiple stages.