SAVIA (Samsung Any VIA) Series, The Newest Multi-Layer Manufacturing Techniques Developed by Samsung Electro-Mechanics for High Density, High Performance Printed Circuit Boards

摘要

In an effort to overcome design limit of existing multi-layer PCB, Samsung Electro-Mechanics Co., Ltd. (SEMCO) has been developed the SAVIA (Samsung Any VIA) series, the most advanced PCB manufacturing techniques. SAVIA series has been successfully developed in SEMCO. Each SAVIA process has been passed reliability test, including thermal cycling, LLTS, HAST, solder treatment and IR-Reflow, and shows excellent electro-physical properties. Also, cost saving was achieved by introducing parallel lamination techniques. The vacuum printing technology was found to be effective to realize complete filling of highly viscous conductive Cu paste into IVHs. In this paper, SEMCO's most recent two SAVIA techniques, any layer IVH and BVH sequential build-up technique (SAVIA-Sequential process) and any layer IVH parallel lamination technique (SAVIA-Parallel process), are introduced with the designing concepts, manufacturing processes, and the reliability matters.