The present invention relates to a BG package and a method of manufacturing the same, wherein the dimples punched to form the same height and size function as electrical connection terminals, thereby improving reliability when mounted on a PCB, and mounting solder balls on the multilayer wiring board. In order to solve the problem of defective products caused by placing some solder balls in the wrong position, and to mount and fix the solder balls by attaching and fixing the dimple forming conductor plate produced by a separate process at once. It saves time, and the conductor plate functions as a heat sink that releases heat, so it can be applied to products with high heat generation, requiring high power.
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