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Proceedings of 2008 international conference on electronic packaging technology & high density packaging (ICEPT-HDP 2008)

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1.Analysis of Electromagnetic Wave Propagation Characteristics in Rotating Environments

机译：旋转环境下电磁波传播特性分析
- 作者：Li Huang;Guoqing Shi
- 会议名称：《Proceedings of 2008 international conference on electronic packaging technology high density packaging (ICEPT-HDP 2008)》 | 2008年
2.Electrodeposition of Palladium Films on Ni-Co Coatings

机译：Ni-Co涂层上钯膜的电沉积
- 作者：Jun Fang
- 会议名称：《Proceedings of 2008 international conference on electronic packaging technology high density packaging (ICEPT-HDP 2008)》 | 2008年
3.Titania Nanostructures Fabricated Through Anodization of Ti6Al4V Alloy

机译：Ti6Al4V合金阳极氧化制备的二氧化钛纳米结构
- 作者：Yunhe Li;Zepe Yuan
- 会议名称：《Proceedings of 2008 international conference on electronic packaging technology high density packaging (ICEPT-HDP 2008)》 | 2008年
4.The Influence of Low level Doping of Ni on the Microstructure and Reliability of SAC Solder Joint

机译：镍的低掺杂对SAC焊点组织和可靠性的影响
- 作者：Xiao-ning Liu;Wen-Chao Li
- 会议名称：《Proceedings of 2008 international conference on electronic packaging technology high density packaging (ICEPT-HDP 2008)》 | 2008年
5.BGA Assembly Process Development for 45nm ELK CUP Devices

机译：45nm ELK CUP器件的BGA组装工艺开发
- 作者：Ke-wu YAN;Jin-fu ZHU
- 会议名称：《Proceedings of 2008 international conference on electronic packaging technology high density packaging (ICEPT-HDP 2008)》 | 2008年
6.The Effects of Ni Nanoparticles Addition on Shear Behavior and Microstructure of Sn-Ag Lead-free Solder

机译：纳米镍的添加对锡银无铅焊料剪切行为和微观结构的影响
- 作者：Wenhui Zhao;Quansheng Shi
- 会议名称：《Proceedings of 2008 international conference on electronic packaging technology high density packaging (ICEPT-HDP 2008)》 | 2008年
- Lead-free solder, Ni nanoparticles, shear performance, microstructure, IMC;
7.C4NP for Pb-Free Solder Wafer Bumping and 3D Fine-Pitch Applications

机译：C4NP用于无铅焊锡凸块和3D细间距应用
- 作者：Erming Yuan;Biao Li
- 会议名称：《Proceedings of 2008 international conference on electronic packaging technology high density packaging (ICEPT-HDP 2008)》 | 2008年
8.Manufacture of Hourglass-shaped Solder Joint by Induction Heating Reflow

机译：感应加热回流制造沙漏形焊点
- 会议名称：《Proceedings of 2008 international conference on electronic packaging technology high density packaging (ICEPT-HDP 2008)》 | 2008年
9.New Piezo Actuated Dispensing Method for Consistent Solder Paste Dots

机译：一致的锡膏点的压电致动点胶新方法
- 作者：Qiang Chen;Weiwei Wu;Bo Yu
- 会议名称：《Proceedings of 2008 international conference on electronic packaging technology high density packaging (ICEPT-HDP 2008)》 | 2008年
10.Nanoscale Analysis of Ultrasonic Wedge Bond Interface by Using High-Resolution Transmission Electron Microscopy

机译：超声透射电子显微镜对超声楔形键界面的纳米分析
- 作者：Zhonghua Deng;Tianfang Zhu;Ling Luo
- 会议名称：《Proceedings of 2008 international conference on electronic packaging technology high density packaging (ICEPT-HDP 2008)》 | 2008年
11.Limited β-Sn grain number of miniaturized Sn-Ag-Cu solder joints

机译：小型Sn-Ag-Cu焊点的有限β-Sn晶粒数
- 作者：Lu-bang Wang;Xing-san Qian
- 会议名称：《Proceedings of 2008 international conference on electronic packaging technology high density packaging (ICEPT-HDP 2008)》 | 2008年
12.Manufacture, Microstructure and Microhardness Analysis of Sn-Bi Lead-Free Solder Reinforced with Sn-Ag-Cu Nano-particles

机译：Sn-Ag-Cu纳米粒子增强Sn-Bi无铅焊料的制备，组织和显微硬度分析
- 作者：lianghai Lei;lin Dong
- 会议名称：《Proceedings of 2008 international conference on electronic packaging technology high density packaging (ICEPT-HDP 2008)》 | 2008年
13.A comparison study of two different methods to synthesize magnetic slurry for the fabrication of magnetic films

机译：两种制备磁性膜的磁性浆料合成方法的比较研究
- 作者：Shuang Liang;Fan Xu;Yingying Su;Wanshan Wang
- 会议名称：《Proceedings of 2008 international conference on electronic packaging technology high density packaging (ICEPT-HDP 2008)》 | 2008年
14.Microstructure and Properties of Barium Strontium Titanate Thin Films Prepared on Copper Foils via Addition of PEG to the Sol Precursor

机译：通过在溶胶前体中加入PEG在铜箔上制备钛酸锶锶钡薄膜的微观结构和性能
- 作者：Lili ZHANG;Guangle YAN;Jijia SUN
- 会议名称：《Proceedings of 2008 international conference on electronic packaging technology high density packaging (ICEPT-HDP 2008)》 | 2008年
- BST thin film, dielectric constant, Leakage current, dielectric loss;
15.Dynamic Behavior Tests of Lead-free Solders at High Strain Rates by the SHPB Technique

机译：SHPB技术在高应变率下对无铅焊料的动态行为测试
- 作者：Jin-lu SHENG;Ya-bing ZHAO;Ying-xiang TENG;Jun-feng XIN
- 会议名称：《Proceedings of 2008 international conference on electronic packaging technology high density packaging (ICEPT-HDP 2008)》 | 2008年
16.Formation of Double-layer Cu3Sn in Solid-State Aging Process at the Interface of Eutectic SnBi Solder and (100) Single Crystal Cu

机译：在共晶SnBi焊料与（100）单晶Cu界面处的固态时效过程中形成双层Cu3Sn
- 作者：Jie SANG;Feng LIN
- 会议名称：《Proceedings of 2008 international conference on electronic packaging technology high density packaging (ICEPT-HDP 2008)》 | 2008年
17.Synthesis of High Purity O-cresol Novolac Epoxy Resins

机译：高纯度邻甲酚酚醛清漆环氧树脂的合成
- 作者：Jun-feng XIN;Qi-min FENG;Tian-shui XU
- 会议名称：《Proceedings of 2008 international conference on electronic packaging technology high density packaging (ICEPT-HDP 2008)》 | 2008年
- o-cresol novolac resin;
- o-cresol novolac epoxy resin;
- high purity;
- hydrolyzable halide;
18.Defect Analysis of Copper Ball Bonding

机译：铜球键合缺陷分析
- 作者：Zhihua Wang
- 会议名称：《Proceedings of 2008 international conference on electronic packaging technology high density packaging (ICEPT-HDP 2008)》 | 2008年
19.Fundamental Influence of Segregated Bi on the Mechanical Properties of Interconnect of Bismuth-containing Solder and Copper

机译：偏析铋对含铋焊料和铜互连机械性能的基本影响
- 作者：Jiaqin Yang;Huei Lee
- 会议名称：《Proceedings of 2008 international conference on electronic packaging technology high density packaging (ICEPT-HDP 2008)》 | 2008年
20.Effects of Bi and Ni Addition on Wettability and Melting Point of Sn-0.3Ag-0.7Cu Low-Ag Pb-free Solder

机译：Bi和Ni的添加对Sn-0.3Ag-0.7Cu低Ag无铅焊料的润湿性和熔点的影响
- 作者：Jin Chen;Xiao-hua Luo
- 会议名称：《Proceedings of 2008 international conference on electronic packaging technology high density packaging (ICEPT-HDP 2008)》 | 2008年
21.Moisture Diffusion Model Verification of Packaging Materials

机译：包装材料的水分扩散模型验证
- 作者：Rui ZHANG;Xing-san QIAN
- 会议名称：《Proceedings of 2008 international conference on electronic packaging technology high density packaging (ICEPT-HDP 2008)》 | 2008年
22.Recent Progress of Carbon Nanotubes as Cooling Fins in Electronic Packaging

机译：碳纳米管作为电子封装散热片的最新进展
- 作者：Huanmei Qin;Shaorong Sun
- 会议名称：《Proceedings of 2008 international conference on electronic packaging technology high density packaging (ICEPT-HDP 2008)》 | 2008年
23.Environmentally Friendly Electronics for High Reliability

机译：高可靠性的环保电子产品
- 作者：Ying CHU
- 会议名称：《Proceedings of 2008 international conference on electronic packaging technology high density packaging (ICEPT-HDP 2008)》 | 2008年
24.Morphology, Evolution and Performance of IMC in SAC105 Solder/UBM (Ni (P)-Au)

机译：IMC在SAC105焊料/ UBM（Ni（P）-Au）中的形态，演变和性能
- 作者：Bernd Bilitewski
- 会议名称：《Proceedings of 2008 international conference on electronic packaging technology high density packaging (ICEPT-HDP 2008)》 | 2008年
25.Development of High Temperature Stable Isotropic Conductive Adhesives

机译：高温稳定的各向同性导电胶的开发
- 作者：Bernhard Raninger;LI Rundong;FENG Lei;ZHANG Hailian
- 会议名称：《Proceedings of 2008 international conference on electronic packaging technology high density packaging (ICEPT-HDP 2008)》 | 2008年
26.Microstructural and physical characteristics of Sn-Ag-Cu-Mg Lead-free Solders

机译：Sn-Ag-Cu-Mg无铅焊料的微观结构和物理特性
- 作者：Abdallah Nassour;Abdulkader Majanny;Michael Nelles
- 会议名称：《Proceedings of 2008 international conference on electronic packaging technology high density packaging (ICEPT-HDP 2008)》 | 2008年
- lead-free solders;
- Sn-Ag-Cu-Mg;
- meltingtemperature;
- wettability;
- microstructure;
27.Microstructural Investigation on the Interfacial Evolution of SnBi/Cu Interconnect during Reflow and Solid-State Aging

机译：回流和固态时效过程中SnBi / Cu互连件界面演变的显微组织研究
- 作者：Michael Nelles;Gert Morscheck
- 会议名称：《Proceedings of 2008 international conference on electronic packaging technology high density packaging (ICEPT-HDP 2008)》 | 2008年
28.Dynamic Mechanical Properties of the Transparent Silicone Resin for High Power LED Packaging

机译：大功率LED封装用透明硅树脂的动态力学性能
- 作者：Schweers Wilko;CHEN Youjian;Ewald Schnug;Wolfgang Walther
- 会议名称：《Proceedings of 2008 international conference on electronic packaging technology high density packaging (ICEPT-HDP 2008)》 | 2008年
29.Study of Five Substrate Pad Finishes for the Co-design of Solder Joint Reliability under Board-level Drop and Temperature Cycling Test Conditions

机译：在电路板级跌落和温度循环测试条件下，针对五种基体焊盘光洁度共同设计焊点可靠性的研究
- 作者：KIM Youngchul;YI Qitao;KIM Leehyung;MIN Kyungsuk
- 会议名称：《Proceedings of 2008 international conference on electronic packaging technology high density packaging (ICEPT-HDP 2008)》 | 2008年
- pad finish, NiAu, OSP, SoP, Immersion Tin,NiPdAu, solder joint reliability, IMC, drop test, temperature cycling test, high-speed solder ball shear test;
30.The Influence of Heat Treatment on the Adhesion between Molding Compound and Lead Frame

机译：热处理对模塑料与引线框之间附着力的影响
- 作者：Stephan Glatzel
- 会议名称：《Proceedings of 2008 international conference on electronic packaging technology high density packaging (ICEPT-HDP 2008)》 | 2008年
31.Effects of Bonding Pressure on Nonlinear Dynamic Characteristic of the Ultrasonic Wire Bonding System

机译：键合压力对超声波导线键合系统非线性动力学特性的影响
- 作者：DING Yuanhong;WANG Qing;WANG Feifei;REN Hongqiang
- 会议名称：《Proceedings of 2008 international conference on electronic packaging technology high density packaging (ICEPT-HDP 2008)》 | 2008年
32.Effects of Ni addition on Microstructure and the Shear Strength of Sn-3.0Ag-0.5Cu/Cu Solders Joints

机译：镍添加对Sn-3.0Ag-0.5Cu / Cu焊点组织和剪切强度的影响
- 作者：TANG Lihua;LING Qi
- 会议名称：《Proceedings of 2008 international conference on electronic packaging technology high density packaging (ICEPT-HDP 2008)》 | 2008年
33.The Influence of Heating Temperature on Alignment Precision in Thermosonic Flip-chip Bonding

机译：加热温度对热超声倒装芯片键合对准精度的影响
- 作者：HUANG Xiaoming;CHEN Tianhu;PAN Min
- 会议名称：《Proceedings of 2008 international conference on electronic packaging technology high density packaging (ICEPT-HDP 2008)》 | 2008年
34.An Investigation of Capillary Vibration during Wire Bonding Process

机译：引线键合过程中毛细管振动的研究
- 作者：BAO Lining;HUANG Xianhuai;ZHANG Yubo
- 会议名称：《Proceedings of 2008 international conference on electronic packaging technology high density packaging (ICEPT-HDP 2008)》 | 2008年
- Wire bonding, Laser Doppler Interferometer,FE analysis, Monitoring bond quality.;
35.The Optimization of Hierarchical SOC Test Architecture to Reduce Test Time

机译：分层SOC测试架构的优化以减少测试时间
- 作者：LI Jie;CHEN Shijun;WANG Jianhua;ZHANG Guosheng
- 会议名称：《Proceedings of 2008 international conference on electronic packaging technology high density packaging (ICEPT-HDP 2008)》 | 2008年
36.A High Speed Image Preprocessing Method for IC Wafer Inspection

机译：IC晶圆检查的高速图像预处理方法
- 作者：LI Zhengyao;WANG Li
- 会议名称：《Proceedings of 2008 international conference on electronic packaging technology high density packaging (ICEPT-HDP 2008)》 | 2008年
37.The Influence Discipline of Temperature of High Viscosity Fluid Jetting

机译：高粘度流体喷射温度的影响规律
- 作者：LV Liang;YIN Fucai;QIAN Jiazhong;SUN Shiqun
- 会议名称：《Proceedings of 2008 international conference on electronic packaging technology high density packaging (ICEPT-HDP 2008)》 | 2008年
- thermal analysis, jetting dispensing, temperature field, high viscosity, fluid-structure interaction analysis;
38.The Influence of Structural Parameters of Electromagnetic Fluid Jetting Dispenser

机译：电磁流体喷射分配器的结构参数的影响
- 作者：OH Wonchun;CHEN Mingliang;ZHANG Fengjun;BAE Jangsoon
- 会议名称：《Proceedings of 2008 international conference on electronic packaging technology high density packaging (ICEPT-HDP 2008)》 | 2008年
- jet-dispenser;
- cumulative fluid volume;
- FSI;
- mean flow velocity;
39.Dynamic Phase-frequency Characteristic of Thermosonic Wire Bonder Transducer

机译：热超声引线键合传感器的动态相频特性
- 作者：SUN Shiqun;LIANG Min;GAN Hao
- 会议名称：《Proceedings of 2008 international conference on electronic packaging technology high density packaging (ICEPT-HDP 2008)》 | 2008年
- phase-frequency characteristic, Thermosonic wire bonding, transducer, ultrasonic generator, frequency tracking.;
40.Study of Prepress Force on Piezoelectric Transducer of Wire Bonding

机译：引线键合压电换能器预压力的研究
- 作者：OH Wonchun;JUNG Ahreum;ZHANG Fengjun;CHEN Mingliang;KO Weonbae
- 会议名称：《Proceedings of 2008 international conference on electronic packaging technology high density packaging (ICEPT-HDP 2008)》 | 2008年
41.Simulation and Experimental Research on Water-jet guided Laser Cutting Silicon Wafer

机译：水刀激光切割硅片的仿真与实验研究
- 作者：CHEN Mingliang;ZHANG Fengjun;OH Wonchun
- 会议名称：《Proceedings of 2008 international conference on electronic packaging technology high density packaging (ICEPT-HDP 2008)》 | 2008年
42.Research on Solder Joint Intelligent Optical Inspection Analysis

机译：焊点智能光学检测分析研究
- 作者：ZHANG Linnan;WU Yanjun;LI Zhenshan;NI Jinren
- 会议名称：《Proceedings of 2008 international conference on electronic packaging technology high density packaging (ICEPT-HDP 2008)》 | 2008年
43.Productivity Improvement of Stack Package Line through Die Bonding Process Scheme Optimization

机译：通过芯片键合工艺和方案优化提高堆叠包装线的生产率
- 作者：WANG Wanzhen;ZHOU Yuanxiang;WANG Keqing
- 会议名称：《Proceedings of 2008 international conference on electronic packaging technology high density packaging (ICEPT-HDP 2008)》 | 2008年
44.Developing the Stencil Printing Process for 01005 Lead-Free Assemblies

机译：开发用于01005无铅组件的模板印刷工艺
- 作者：ZHOU Yuanxiang;ZHOU Lu;SONG Jing;ZHANG Zhan
- 会议名称：《Proceedings of 2008 international conference on electronic packaging technology high density packaging (ICEPT-HDP 2008)》 | 2008年
45.A Study on Die Rotation Defect for Solder Die Attach Quality Improvement

机译：改善模具附着质量的模具旋转缺陷的研究。
- 作者：WANG Keqing;ZHOU Yuanxiang;WANG Wanzhen
- 会议名称：《Proceedings of 2008 international conference on electronic packaging technology high density packaging (ICEPT-HDP 2008)》 | 2008年
46.Shear of Sn-3.8Ag-0.7Cu Solder Balls on Electrodeposited FeNi Layer

机译：电沉积FeNi层上Sn-3.8Ag-0.7Cu焊球的剪切
- 作者：SHI Hongwei;XU Guangquan;HE Xiaowen
- 会议名称：《Proceedings of 2008 international conference on electronic packaging technology high density packaging (ICEPT-HDP 2008)》 | 2008年
47.IMC Formation between Electroless Ni/Pd/Au Surface Finish and SnAgCu Solder

机译：Ni / Pd / Au化学镀层与SnAgCu焊料之间的IMC形成
- 作者：LIU Yong;QIAN Jiazhong;WANG Lulu;CHEN Zhou
- 会议名称：《Proceedings of 2008 international conference on electronic packaging technology high density packaging (ICEPT-HDP 2008)》 | 2008年
48.Optimization of the Fatigue Life of Epoxy Molding Compounds based on BP Neural Network Prediction Model

机译：基于BP神经网络预测模型的环氧胶的疲劳寿命优化。
- 作者：LIU Yu;CHEN Tianhu;SUN Yubin;HUANG Xiaoming;SHI Ying
- 会议名称：《Proceedings of 2008 international conference on electronic packaging technology high density packaging (ICEPT-HDP 2008)》 | 2008年
- optimization;
- BP neural network (BPNN);
- fatigue life;
- principal component analysis (PCA);
- genetic algorithms (GA);
- stability.;
49.Electromigration Behavior of the Ni/SnZn/Cu Solder Interconnect

机译：Ni / SnZn / Cu焊料互连的电迁移行为
- 作者：XIONG Changjun;CHEN Tianhu;WANG Jian
- 会议名称：《Proceedings of 2008 international conference on electronic packaging technology high density packaging (ICEPT-HDP 2008)》 | 2008年
50.Effect of displacement rate on lap shear test of SAC solder ball joints

机译：位移速率对SAC焊球接头搭接剪切试验的影响
- 作者：YUE Mei
- 会议名称：《Proceedings of 2008 international conference on electronic packaging technology high density packaging (ICEPT-HDP 2008)》 | 2008年
51.Analysis on Cracking Blind Vias of PCB for Mobile Phones

机译：手机PCB开裂盲孔的分析
- 作者：XU Guangquan;YUE Mei
- 会议名称：《Proceedings of 2008 international conference on electronic packaging technology high density packaging (ICEPT-HDP 2008)》 | 2008年
52.Interfacial Reaction and Failure Mechanism for SnAgCu Solder Bump with Ni(V)/Cu Under Bump Metallization During Aging

机译：Ni（V）/ Cu SnAgCu钎料在时效过程中金属化下的界面反应及破坏机理
- 作者：WANG Lingling;YUE Mei;QIAN Jiazhong
- 会议名称：《Proceedings of 2008 international conference on electronic packaging technology high density packaging (ICEPT-HDP 2008)》 | 2008年
53.Capability Study on the Destructive Pull Test of 1 Mil Gold Wire Bond and Its Asymmetric Distribution

机译：1 Mil金线键合破坏性拉力试验及其不对称分布的能力研究
- 作者：ZHANG Gang;GUI Herong
- 会议名称：《Proceedings of 2008 international conference on electronic packaging technology high density packaging (ICEPT-HDP 2008)》 | 2008年
54.Cavitation instability in Valanis-Landel hyperelastic IC packaging material

机译：Valanis-Landel超弹性IC封装材料的空化不稳定性
- 作者：LV Hui;SUN Shiqun
- 会议名称：《Proceedings of 2008 international conference on electronic packaging technology high density packaging (ICEPT-HDP 2008)》 | 2008年
- vapor pressure, unstable void growth,hyperelastic material;
55.Moisture Absorption and Void Growing Effects on Failure of Electronic Packaging

机译：水分吸收和空隙生长对电子包装失效的影响
- 作者：PAN Zhengwei;WU Kaiya;HUANG Qun
- 会议名称：《Proceedings of 2008 international conference on electronic packaging technology high density packaging (ICEPT-HDP 2008)》 | 2008年
- moisture diffusion, moisture absorption, vapor pressure, finite element simulation.;
56.Mechanical Test after Temperature Cycling on Lead-free Sn-3Ag-0.5Cu Solder Joint

机译：无铅Sn-3Ag-0.5Cu焊点温度循环后的机械测试
- 作者：SUN Shiqun;LIANG Xi;IANG Min;QIAN Jiazhong;CUI Kangping;LI Xiangling
- 会议名称：《Proceedings of 2008 international conference on electronic packaging technology high density packaging (ICEPT-HDP 2008)》 | 2008年
- Filp chip, TCT, Sn-37Pb, Sn-3Ag-0.5Cu, shear test, FE-EPMA;
57.A Study of Software Defects Prediction Technique Based on Bayesian Network

机译：基于贝叶斯网络的软件缺陷预测技术研究
- 作者：MA Minghai;PENG Shuchuan;XU Shengyou;SHE Xinsong
- 会议名称：《Proceedings of 2008 international conference on electronic packaging technology high density packaging (ICEPT-HDP 2008)》 | 2008年
- Software Defects, Bayesian Network, Bayesian Formula;
58.Reliability Challenges and Design Considerations for Wafer-Level Packages

机译：晶圆级封装的可靠性挑战和设计考虑因素
- 作者：YANG Bo;HU Manyin;XU Qinyun;ZHANG Shuo;DU Xin
- 会议名称：《Proceedings of 2008 international conference on electronic packaging technology high density packaging (ICEPT-HDP 2008)》 | 2008年
59.Mixed Mode Interface Characterization Considering Thermal Residual Stress

机译：考虑热残余应力的混合模式界面表征
- 作者：ZHENG Shuaifei;TONG Zhangfa;CHEN Zhichuan
- 会议名称：《Proceedings of 2008 international conference on electronic packaging technology high density packaging (ICEPT-HDP 2008)》 | 2008年
60.The Effect of Strain Rate and Strain Range on Bending Fatigue Test

机译：应变率和应变范围对弯曲疲劳试验的影响
- 作者：CHANG Dongyin;LI Xiaoxing;CHEN Tianhu
- 会议名称：《Proceedings of 2008 international conference on electronic packaging technology high density packaging (ICEPT-HDP 2008)》 | 2008年
- Strain-controlled bending fatigue test, strain rate,strain range, lifetime, failure mode;
61.Dynamic Properties Testing of Solders and Modeling of Electronic Packages Subjected to Drop Impact

机译：焊料动态特性测试和跌落冲击下的电子封装建模
- 作者：PAN Min;CHEN Tianhu
- 会议名称：《Proceedings of 2008 international conference on electronic packaging technology high density packaging (ICEPT-HDP 2008)》 | 2008年
62.Electromigration in Pb-free Solders

机译：无铅焊料中的电迁移
- 作者：QING Chengsong;YU Xinlin;CHEN Tianhu
- 会议名称：《Proceedings of 2008 international conference on electronic packaging technology high density packaging (ICEPT-HDP 2008)》 | 2008年
63.Effect of Stand-off Height on the Microstructure and Fracture Mode of Cu/Sn-9Zn/Cu Solder Joint under Tensile Test

机译：支座高度对拉伸试验下Cu / Sn-9Zn / Cu焊点组织和断裂模式的影响
- 作者：WANG Yongneng;MA Jianzhong;HU Jing
- 会议名称：《Proceedings of 2008 international conference on electronic packaging technology high density packaging (ICEPT-HDP 2008)》 | 2008年
- stand-off height (SOH);
- microstructure;
- tensile test;
- fracture mode;
64.Failure Mode Analysis of Lead-free Solder Joints under Differential Reflow Profiles by High Speed Impact Testing

机译：高速冲击试验分析不同回流条件下无铅焊点的失效模式
- 作者：WU Qianqian;MU Wenjia;CHEN Jia;CAI Jingmin;WU Ke
- 会议名称：《Proceedings of 2008 international conference on electronic packaging technology high density packaging (ICEPT-HDP 2008)》 | 2008年
65.Influence of Underfill Methods on the Solder Joint Fatigue of Wafer Level Packaging

机译：底部填充方法对晶圆级包装焊点疲劳的影响
- 作者：LIU Bin;SU Mingguang;WU Ke;WU Huan;CAI Jingmin;YU Zhimin
- 会议名称：《Proceedings of 2008 international conference on electronic packaging technology high density packaging (ICEPT-HDP 2008)》 | 2008年
- Reliability, Underfill, Thermal shock,Re-enforcement, CSWLP.;
66.The Role of the Molecular Simulation Approach for IC-backend Developments

机译：分子模拟方法在IC后端开发中的作用
- 作者：WU Huan;SU Mingguang;YU Zhimin;LIU Bin;JIN Jie;CAI Jingmin;WU Ke
- 会议名称：《Proceedings of 2008 international conference on electronic packaging technology high density packaging (ICEPT-HDP 2008)》 | 2008年
67.Strain-rate and Impact Velocity Effects on Joint Adhesion Strength

机译：应变速率和冲击速度对接头粘合强度的影响
- 作者：YANG Yanhong;WU Qianqian;LIU Bin;WANG Hualin
- 会议名称：《Proceedings of 2008 international conference on electronic packaging technology high density packaging (ICEPT-HDP 2008)》 | 2008年
68.Parametric Study on Board-level Electronic Test Device Subjected to JEDEC Vibration Loads

机译：JEDEC振动载荷作用下的板级电子测试设备的参数研究
- 作者：PENG Shuchuan;WANG Xiaoshan;MA Minghai;JIANG Shaotong
- 会议名称：《Proceedings of 2008 international conference on electronic packaging technology high density packaging (ICEPT-HDP 2008)》 | 2008年
69.Modeling Techniques for Board Level Drop Test for a Wafer-Level Package

机译：晶圆级封装的板级跌落测试的建模技术
- 作者：LIU Junsheng
- 会议名称：《Proceedings of 2008 international conference on electronic packaging technology high density packaging (ICEPT-HDP 2008)》 | 2008年
70.Effect of Shear Rate on Lead Free Solder Joint Strength

机译：剪切速率对无铅焊点强度的影响
- 作者：XU Guanglai;HUANG Shuling;YUAN Xintian
- 会议名称：《Proceedings of 2008 international conference on electronic packaging technology high density packaging (ICEPT-HDP 2008)》 | 2008年
71.Analysis and Comparison of Thermal Stress and Hygrothermal Stress of SiP Device By QFN Packaging

机译：QFN封装对SiP器件的热应力和湿热应力的分析与比较
- 作者：HOU Hongxun;WANG Shuying;PENG Yongzhen;WANG Gan;YUAN Zhiguo;WANG Yingzhe
- 会议名称：《Proceedings of 2008 international conference on electronic packaging technology high density packaging (ICEPT-HDP 2008)》 | 2008年
72.Crack Growth Analysis of Ball Grid Array Resistor's Solder Joint Subjected to Thermal Cycling and 4 Point Cycling Bending

机译：球栅阵列电阻焊点在热循环和四点循环弯曲作用下的裂纹扩展分析
- 作者：LING Bin;ZHU Dekai;GU Chenying
- 会议名称：《Proceedings of 2008 international conference on electronic packaging technology high density packaging (ICEPT-HDP 2008)》 | 2008年
73.A Dual-Output Voltage Reference for High-Accuracy Pipelined ADC

机译：用于高精度流水线ADC的双路输出参考电压
- 作者：WU Miao;ZHOU Yuanxiang;SHI Xiuwang
- 会议名称：《Proceedings of 2008 international conference on electronic packaging technology high density packaging (ICEPT-HDP 2008)》 | 2008年
74.In-situ Observation on Electrochemical Migration of Lead-free Solder Joints under Water Drop Test

机译：水滴试验下无铅焊点电化学迁移的原位观察
- 作者：WANG Ye;SUN Shiqun;LIANG Xi
- 会议名称：《Proceedings of 2008 international conference on electronic packaging technology high density packaging (ICEPT-HDP 2008)》 | 2008年
75.Study of Interface Reliability in QFN Device under Hygro-Thermal Environment

机译：湿热环境下QFN器件的接口可靠性研究
- 作者：ZHANG Bo;WU Chundu;XU Xiaohong;CHU Jinyu
- 会议名称：《Proceedings of 2008 international conference on electronic packaging technology high density packaging (ICEPT-HDP 2008)》 | 2008年
- reliability;
- hygro-thermal;
- moisture;
- interface cracks;
- QFN devices;
76.The Reliability Study of Sub 100 Microns SnAg Flip Chip Solder Bump on FR4 Substrate under Thermal Cycling

机译：热循环下FR4基板上100微米以下SnAg倒装焊锡凸块的可靠性研究
- 作者：ZHANG Yue;SUN Shiqun;GUAN Qiuhong
- 会议名称：《Proceedings of 2008 international conference on electronic packaging technology high density packaging (ICEPT-HDP 2008)》 | 2008年
77.Analysis and Solving of the EMI effect on LC-VCO in mixed-signal ICs

机译：混合信号IC中EMI对LC-VCO的影响分析与解决
- 作者：DONG Qiang
- 会议名称：《Proceedings of 2008 international conference on electronic packaging technology high density packaging (ICEPT-HDP 2008)》 | 2008年
78.Thermal Behavior Analysis of Lead-free Flip-Chip Ball Grid Array Packages with Different Underfill Material Properties

机译：不同底部填充材料特性的无铅倒装芯片球栅阵列封装的热行为分析
- 作者：HU Youbiao;CAI Shengyun;DING Jianhua
- 会议名称：《Proceedings of 2008 international conference on electronic packaging technology high density packaging (ICEPT-HDP 2008)》 | 2008年
79.Enrichment and Removal of Heavy Metals Contained in PCB Boards by Multiwalled Carbon Nanotubes for WEEE Directive

机译：WEEE指令用多壁碳纳米管富集和去除PCB板上的重金属
- 作者：LIU Xiaowei;WU Kaiya
- 会议名称：《Proceedings of 2008 international conference on electronic packaging technology high density packaging (ICEPT-HDP 2008)》 | 2008年
- Enrichment and removal, Heavy metals, PCB boards, Multiwalled carbon nanotubes, WEEE directive;
80.A Study on Application of NK Analyzer in OLED Failure Analysis

机译：N＆K分析仪在OLED故障分析中的应用研究
- 作者：YUAN Zhihua;GUI Herong;YAO Enqin;ZHANG Gang
- 会议名称：《Proceedings of 2008 international conference on electronic packaging technology high density packaging (ICEPT-HDP 2008)》 | 2008年
81.Failure Analysis of the First Wire's Bond

机译：第一线键合的失效分析
- 作者：HUANG Shaobin;CHOW Alex Tat-Shing
- 会议名称：《Proceedings of 2008 international conference on electronic packaging technology high density packaging (ICEPT-HDP 2008)》 | 2008年
82.Investigation of Electromigration in Copper Interconnection of ULSI

机译：ULSI铜互连中电迁移的研究
- 作者：GAO Hongliang;WU Gao;LI Jijing
- 会议名称：《Proceedings of 2008 international conference on electronic packaging technology high density packaging (ICEPT-HDP 2008)》 | 2008年
83.Study on MCM Interconnect Test Generation using Ant Algorithm and Particle Swarm Optimization Algorithm

机译：基于蚁群算法和粒子群算法的MCM互连测试生成研究
- 作者：LI Rundong;LI Yanlong;WANG Lei;TIAN Xuehui;KE Xin;LIU Yaoxin
- 会议名称：《Proceedings of 2008 international conference on electronic packaging technology high density packaging (ICEPT-HDP 2008)》 | 2008年
84.MCM Interconnect Test Scheme based on Adaptive Genetic Algorithm

机译：基于自适应遗传算法的MCM互连测试方案
- 作者：LIU Qiuxin;HU Zhongping;LI Shensheng;YANG Erping;DING Yun
- 会议名称：《Proceedings of 2008 international conference on electronic packaging technology high density packaging (ICEPT-HDP 2008)》 | 2008年
- MCM (Multi-chip Module), interconnect test,adaptive genetic algorithm, test generation.;
85.Investigation on Fatigue-creep Interaction Damage Model for Solder

机译：焊料疲劳蠕变相互作用损伤模型的研究
- 作者：GAO Hongliang;Hou Jing;LI Jijing
- 会议名称：《Proceedings of 2008 international conference on electronic packaging technology high density packaging (ICEPT-HDP 2008)》 | 2008年
86.Study of Plasticity Damage Mechanics Constitutive Model for SnAgCu Solder Joint

机译：SnAgCu焊点塑性损伤力学本构模型研究
- 作者：WANG Xiaohui;XU Hui;SUN Shiqun
- 会议名称：《Proceedings of 2008 international conference on electronic packaging technology high density packaging (ICEPT-HDP 2008)》 | 2008年
87.A Design for Increasing the Immunity to RFI of Protection IC of Lithium-ion Battery

机译：一种提高锂离子电池保护IC抗RFI的设计
- 作者：ZHU Qirong
- 会议名称：《Proceedings of 2008 international conference on electronic packaging technology high density packaging (ICEPT-HDP 2008)》 | 2008年
88.The Effect of the Different Teflon Films on Anisotropic Conductive Adhesive Film (ACF) Bonding

机译：不同的聚四氟乙烯薄膜对各向异性导电胶膜（ACF）粘接的影响
- 作者：LIU Zhongmei
- 会议名称：《Proceedings of 2008 international conference on electronic packaging technology high density packaging (ICEPT-HDP 2008)》 | 2008年
89.Reliability Study of Flexible Display Module by Experiments

机译：通过实验研究柔性显示模块的可靠性
- 作者：SHAO Guoquan;YANG Zhanzhao;WANG Min;ZHAO Qiwen
- 会议名称：《Proceedings of 2008 international conference on electronic packaging technology high density packaging (ICEPT-HDP 2008)》 | 2008年
90.Thermal Fatigue Life Analysis and Forecast of PBGA Solder Joints On the Flexible PCB Based on Finite Element Analysis

机译：基于有限元分析的柔性PCB上PBGA焊点热疲劳寿命分析与预测
- 作者：XU Wenlai;ZHANG Jianqiang;FAN Xinjian;LI Wenfeng;DAI Benlin
- 会议名称：《Proceedings of 2008 international conference on electronic packaging technology high density packaging (ICEPT-HDP 2008)》 | 2008年
91.Qualification for Product Development

机译：产品开发资格
- 作者：ZHANG Fengjun;CHEN Mingliang;OH Wonchun
- 会议名称：《Proceedings of 2008 international conference on electronic packaging technology high density packaging (ICEPT-HDP 2008)》 | 2008年
92.MEMS-Market development and new 3D-packaging requirements

机译：MEMS市场开发和新的3D封装要求
- 作者：Guan Qiuhong;Wu Boren;Cui Xi;Zhang Chunlei;Shen Ying
- 会议名称：《Proceedings of 2008 international conference on electronic packaging technology high density packaging (ICEPT-HDP 2008)》 | 2008年
93.Optimization of hierarchical SOC test time based on genetic algorithm

机译：基于遗传算法的SOC分级测试时间优化
- 作者：Mohan Wang;Songdong Ju;Min Zhu
- 会议名称：《Proceedings of 2008 international conference on electronic packaging technology high density packaging (ICEPT-HDP 2008)》 | 2008年
94.Effective Dielectric Constant Method for Trace Impedance Control

机译：跟踪阻抗控制的有效介电常数方法
- 作者：Jian-jia He;Fu-yuan Xu;Zhi-li Ding;Cai-hong Liu
- 会议名称：《Proceedings of 2008 international conference on electronic packaging technology high density packaging (ICEPT-HDP 2008)》 | 2008年
95.Study on No-fillet SMT Solder Joint Reliability Based on Solder Joint Shape CAD

机译：基于焊点形状CAD的无倒角SMT焊点可靠性研究
- 作者：Jingyan Ge;Peiqing Huang;Juan Li
- 会议名称：《Proceedings of 2008 international conference on electronic packaging technology high density packaging (ICEPT-HDP 2008)》 | 2008年
- Solder joint shape;
- No-fillet;
- Process parameters;
- Variance analysis;
- Reliability;
96.Simulation and Experiment Study of Dispensing Patterns Influence on Underfill Filling Process

机译：分配方式对底部填充过程影响的仿真与实验研究
- 作者：Jiaqi Fu;Chunming Ye;Lulu Zhu
- 会议名称：《Proceedings of 2008 international conference on electronic packaging technology high density packaging (ICEPT-HDP 2008)》 | 2008年
- dispensing pattern;
- underfill, capillary flow;
- 3-D numerical simulation;
- surface tension.;
97.Study on Thermal Simulation Technology for SMA in Lead-free Reflow Soldering

机译：无铅回流焊中SMA热模拟技术的研究
- 作者：Xinrui Zhang;Hengshan Wang;Jiaqin Yang
- 会议名称：《Proceedings of 2008 international conference on electronic packaging technology high density packaging (ICEPT-HDP 2008)》 | 2008年
- Surface Mounted Assembly;
- Lead-free Reflow Soldering;
- Orthogonal Experiment Design;
- Thermal Analysis;
98.A Novel High Effective Envelope-tracking Amplifier for OFDM Systems

机译：一种用于OFDM系统的新型高效包络跟踪放大器
- 作者：Zhijue Zhang;Dingyu Wu
- 会议名称：《Proceedings of 2008 international conference on electronic packaging technology high density packaging (ICEPT-HDP 2008)》 | 2008年
- Amplifier;
- Envelop tracing, OFDM;
- Wimax.;
99.A Dual-band MEMS PA Study for Mobile Communication Systems

机译：用于移动通信系统的双频MEMS PA研究
- 作者：Jun-Min Yang;Bo Xu
- 会议名称：《Proceedings of 2008 international conference on electronic packaging technology high density packaging (ICEPT-HDP 2008)》 | 2008年
- Dual-band;
- MEMS switch;
- PA;
- PAE.;
100.Optical Analysis of A 3W Light-Emitting Diode (LED) MR16 Lamp

机译：3W发光二极管（LED）MR16灯的光学分析
- 作者：Guohe Deng
- 会议名称：《Proceedings of 2008 international conference on electronic packaging technology high density packaging (ICEPT-HDP 2008)》 | 2008年